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Articles Tagged with ''high''

AVX announces new Modelithics models for MLO inductor series

Software/EDA
October 30, 2013

AVX Corp. announces the availability of new Modelithics models for its 0402 tight tolerance, high current, and high Q multilayer organic (MLO) inductor series. The latest additions to AVX’s Modelithics Component Model Library are part-value sensitive, substrate scalable, and fully integrated with a range of software applications.


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Compact 3/4W Chip Attenuator for Ku, K & Ka Bands

October 23, 2013

AV0904GA attenuatorBarry Industries, an ISO9001:2008 certified, ITAR registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging, introduces a new 0904 size chip attenuator for Ku, K and Ka Bands. The AV0904GA attenuator has been characterized to 30 GHz, features gold wirebondable I/O terminals with epoxy mount ground pads and is rated to 750 mW. Typical VSWR is 1.20:1 from DC to 18 GHz and 1.50:1 to 30 GHz.


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Linear introduces 42 V, 4 A (IOUT), synchronous step-down silent switcher

October 21, 2013

Linear Technology Corp. announces the LT8614, a 4 A, 42 V input capable synchronous step-down switching regulator. A unique Silent Switcher™ architecture reduces EMI/EMC emissions by more than 20 dB, well below the CISPR 25 Class 5 limit. Even with switching frequencies in excess of 2 MHz, synchronous rectification delivers efficiency as high as 96% while Burst Mode® operation keeps quiescent current under 2.5 µA in no-load standby conditions.


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AVX exhibits full range of MLO diplexers at EuMW 2013

October 3, 2013

AVX Corp., a leading manufacturer of advanced passive components and interconnect solutions, is showcasing its full range of MLO™ diplexers at the European Microwave Week Exhibition. Based on its patented multilayer organic high density interconnect technology, AVX’s MLO diplexers employ high dielectric constant and low loss materials to realize high Q printed passive elements, such as inductors and capacitors in multilayer stack ups. 


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Richardson RFPD introduces new low loss, high density SiC MOSFET power modules from Microsemi

September 27, 2013

Richardson RFPD Inc. announces availability and full design support capabilities for eleven new low loss, high density silicon carbide (SiC) MOSFET power modules from Microsemi Corporation (Microsemi).


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Skyworks introduces low current LNA for ISM Band and VHF wireless apps

RFIC
September 26, 2013

Skyworks introduces a low noise amplifier with high linearity and excellent return loss, while drawing as low as 5 mA of bias current.  The internal active bias circuitry of the SKY67015-396LF LNA provides stable performance over temperature and process variation.


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MACOM introduces industry’s first surface mount L-Band 90W GaN power module

September 24, 2013

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, today announced the newest entry in its portfolio of GaN in Plastic packaged power products. Optimized for L-Band commercial air traffic control, military radar, and long range perimeter monitoring applications at 1.2 to 1.4 GHz, MACOM’s new 2-stage, fully matched GaN in Plastic power module scales to peak pulse power levels of 100W in a 14 x 24 mm package size – delivering twice the power of comparably sized competing products.


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MACOM announces high power C-Band GaAs MMIC amplifier in plastic packaging

RFIC
September 11, 2013

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, announced a new high power amplifier that is ideally suited for C-Band radar and communication applications.


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MACOM announces 10 W amplifier for 2-6 GHz broadband high power applications

August 1, 2013

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, announced a new MMIC power amplifier for high power broadband applications.


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TMD Technologies to exhibit high power amplifiers for HIRF testing at EMC 2013

July 31, 2013

TMD has announced it will be exhibiting for the first time at the IEEE International Symposium on Electromagnetic Compatibility, which will take place in August in Denver, Colorado.


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