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Articles Tagged with ''passive''
Passive Plus Inc. now offers an extended-values for the traditional Hi-Q high power, low ESR/ESL, low noise, high self-resonance ultra-stable performance capacitors. Usually used for wireless broadcasting equipment, mobile base stations, GPS portables, MRI coils and radar, these capacitors are 100 percent RoHS and offered in magnetic and non-magnetic terminations. These capacitors are designed and manufactured to meet the requirements for MIL-PRF-55681 and MIL-PRF-123.
AVX Corp., a leading manufacturer of advanced passive components and interconnect solutions, is showcasing its full range of MLO™ diplexers at the European Microwave Week Exhibition. Based on its patented multilayer organic high density interconnect technology, AVX’s MLO diplexers employ high dielectric constant and low loss materials to realize high Q printed passive elements, such as inductors and capacitors in multilayer stack ups.
Pulse Electronics Corp., a leading provider of electronic components, now announces in-house capability to integrate passive surface mount technology (SMT) components on 3D laser direct structuring (LDS) antennas. Incorporating SMT components with the 3D LDS antenna structure saves space on the mobile device's printed circuit board and optimizes the use of available space on the antenna.
AVX Corp. announced its new low-profile 0603 diplexer at the International Microwave Symposium in Seattle, WA. Based on the company’s patented multilayer organic high density interconnect technology, the new 0603 MLO™ diplexer employs high dielectric constant and low loss materials to realize high Q passive printed elements, such as inductors and capacitors in a multilayer stack up.
AWR Corp., the innovation leader in high-frequency EDA software and Modelithics Inc., the industry leader in simulation models for RF, microwave, and millimeter-wave devices, announce the availability of Version 10.1 of the Modelithics COMPLETE Library of passive and active device models for AWR’s Microwave Office® high-frequency design software.
IPDiA extends its scope and offers semiconductor process optimization and transfer applied to medical and Hi-Rel applications
After obtaining ISO 13485 certification in 2012 for medical devices, and in order to respond to the growing demand of customers in the medical and Hi-Rel applications, IPDiA unveils its ability to offer advanced foundry services.
AEM Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM process eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dippingwhile ensuring that converted component terminations contain a minimum of 5 percent Pb as verified by SEM/EDS and XRF inspection methods.
Sonnet Software Inc. announces a new product, Blink™, which is an easy-to-use EDA environment for the analysis of on chip passive devices such as spiral inductors and MIM capacitors.
AWT Global’s new ATC series low PIM anechoic chambers are designed for measuring antennas from 700 to 6000 MHz. Besides the high shielding coefficient of more than 90 dB, ATC series antenna test chambers generate lowest residual passive intermodulation (PIM). The combination of chamber geometry, specifically designed pyramidal electromagnetic absorbing material and innovative manufacturing techniques result in remarkable characteristics.
Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announced plans to release a new omnidirectional antenna specifically designed for broadband in-building distribution of modern wireless communication systems such as LTE, GSM, CDMA, PCS, 3G, WiFi, WLAN services in Q2 to the North American market.