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Articles Tagged with ''passive''

Passive Plus announces lot coded marking on all leaded capacitors

 Passive Plus, Inc., (PPI) in another industry first,now provides as standard, lot code marking on all leaded capacitors. 


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Passive Plus and Modelithics partner develop low and ultra-low ESR capacitor models

Modelithics and Passive Plus, a valued Modelithics Vendor Partner (MVP), are pleased to announce the availability of high-accuracy simulation models for a number of Passive Plus capacitor families.  The Modelithics COMPLETE Library, now contains microwave Global™ models  for Passive Plus 0505C and 1111C Low ESR capacitors, and the 0201N, 0402N, 0603N, and 0805N ultra-low ESR capacitor families. A Passive Plus broadband capacitor model (0201BB104) has also been added, and features validation up to 65GHz. 


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RFID market grows 17% in one year to $9.2B

New research conducted by IDTechEx, and published in the report "RFID Forecasts, Players and Opportunities 2014-2024," finds that the RFID market - including tags, readers, software and services, for passive and active RFID - will grow from $7.88 billion in 2013 to $9.2 billion in 2014. Most growth is due to active RFID/RTLS systems, interrogators, and then tags, in terms of total money spent.


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Agilent announces passive network probing solution for LTE networks

Agilent Technologies Inc. announced a significant enhancement to its Passive Network Monitoring System for converged telecommunication networks across 2G, 2.5G, 3G and now 4G LTE technologies.


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Sonnet introduces Blink, the first full-wave multi-solver suite for on-chip passive device modeling

Software/EDA

Sonnet Software Inc. introduces Blink™, the first multi-solver passive device modeling suite, now available for purchase. Blink operates entirely from within the Cadence® Virtuoso® environment and is used for the analysis of on-chip passive devices such as spiral inductors and MIM capacitors.


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In-building wireless market reaches $8.5B in 2019

ABI Research expects the market for in-building wireless equipment and deployments to grow to over $8 billion in 2019, up from a forecast $4.4 billion for 2014 representing a 14% compound annual growth rate (CAGR).


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RFS enhances support for in-building applications with new plenum-rated omni-directional antennas

As the ability to provide consistent wireless coverage and capacity to support uninterrupted wireless services indoors is critical for operators, Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, is continuing to enhance its portfolio of products to support wireless in-building solutions. As part of this ongoing focus to enable operators to seamlessly bring the network inside the buildings where service is demanded, RFS announced the release of its I-ATO3-698/2700 Series of plenum-rated, PIM-certified omni-directional antennas.


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Passive Plus offers extended values for Hi-Q capacitors

Passive Plus Inc. now offers an extended-values for the traditional Hi-Q high power, low ESR/ESL, low noise, high self-resonance ultra-stable performance capacitors. Usually used for wireless broadcasting equipment, mobile base stations, GPS portables, MRI coils and radar, these capacitors are 100 percent RoHS and offered in magnetic and non-magnetic terminations. These capacitors are designed and manufactured to meet the requirements for MIL-PRF-55681 and MIL-PRF-123.


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AVX exhibits full range of MLO diplexers at EuMW 2013

AVX Corp., a leading manufacturer of advanced passive components and interconnect solutions, is showcasing its full range of MLO™ diplexers at the European Microwave Week Exhibition. Based on its patented multilayer organic high density interconnect technology, AVX’s MLO diplexers employ high dielectric constant and low loss materials to realize high Q printed passive elements, such as inductors and capacitors in multilayer stack ups. 


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Pulse Electronics introduces enhanced LDS antennas including integrated SMT components

Pulse Electronics Corp., a leading provider of electronic components, now announces in-house capability to integrate passive surface mount technology (SMT) components on 3D laser direct structuring (LDS) antennas. Incorporating SMT components with the 3D LDS antenna structure saves space on the mobile device's printed circuit board and optimizes the use of available space on the antenna.


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