RFMW Ltd. announces that Kevin Larue has joined their organization as worldwide Director of Coaxial Components. Larue has served in senior management positions at well known RF industry OEMs such as Molex/Koch Industries, Rosenberger, Radiall, M/A-COM, Amphenol, Matrix Science/AMP and Hughes Aircraft Co., Connecting Devices Division.
Passive Plus Inc. (PPI), a Modelithics® Vendor Partner (MVP), is now offering design engineers a Free 90-Day Trial license for the Modelithics PPI Component Library. This will provide PPI customers access to extremely accurate scalable simulation models for Passive Plus capacitors with advanced features that enable a more precise and rapid design process.
Smart Equipment Technology (SET), a leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies, using direct copper-to-copper bonding.
CTS Corp., through its subsidiary, CTS Electronic Components, Inc. is unveiling a series of Stratum 3 performance temperature compensated crystal oscillators (TCXOs) at International Microwave Symposium (IMS) in Phoenix, Ariz. at Booth #2930, May 19-21, 2015.
Richardson RFPD Inc. announces its attendance and participation at the 2015 IEEE MTT International Microwave Symposium (IMS), the premiere international gathering for all aspects of microwave theory and practice.
M/A-COM Technology Solutions Holdings, Inc., announced it has entered into a definitive agreement to acquire BinOptics Corp., a leading merchant provider of indium phosphide lasers for data centers, mobile backhaul, silicon photonics and access networks.
For the first quarter of 2014, vendors reported revenue affected by certain component shortages which are forecast to lift towards the end of the second quarter or the beginning of the third quarter this year.