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Articles Tagged with ''component''

Smart Equipment Technology (SET) joins IRT Nanoelec 3D integration program

Smart Equipment Technology (SET), a leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies, using direct copper-to-copper bonding.


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Mentor Graphics launches new Xpedition platform to optimize advanced PCB systems design productivity

Mentor Graphics Corp. announced the first phase of a new systems design enterprise platform to address today’s printed circuit board (PCB) systems challenges of increased complexity, changing team demographics, and systems-aware design requirements. The Mentor Graphics Xpedition™ platform significantly simplifies and accelerates the development of the industry’s most challenging designs. By combining an intuitive design environment with designer-driven automation, the Xpedition platform addresses the changing responsibilities of designers, including global team-based organizations, so that users can perform at expert levels for optimum productivity. The result is shortened product development cycles, minimized design re-spins, and improved product quality. The first phase of the launch announces new Xpedition PCB layout technology.


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Rohde & Schwarz achieves LTE-A Cat6 CA full stack throughput using R&S CMW500 and Qualcomm Gobi 9x35 chipset

In a joint effort, Rohde & Schwarz and Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Inc., have extensively tested the user plane throughput of the new Qualcomm® Gobi™ 9x35  chipset in compliance with 3GPP Release 10 for LTE-Advanced. In the setup on display at Mobile World Congress, the R&S CMW500 wideband radio communication tester from Rohde & Schwarz simulates the LTE-Advanced network.


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