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Articles Tagged with ''circuits''

A*STAR’s IME develops smallest antenna that can increase WiFi speed

A*STAR Institute of Microelectronics
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Researchers from A*STAR’s Institute of Microelectronics (IME) have developed the first compact high performance silicon-based cavity-backed slot (CBS) antenna that operates at 135 GHz. The antenna demonstrated 30 times stronger signal transmission over on-chip antennas at 135 GHz. At just 1.6 mm x 1.2 mm, approximately the size of a sesame seed, it is the smallest silicon-based CBS antenna reported to date for ready integration with active circuits.


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Linear Technology devices power Mars Curiosity rover

Linear Technology Corp.
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Linear Technology Corp., a leading supplier of high performance analog integrated circuits, announced that its products are playing a key role in the Mars rover launched by NASA’s Jet Propulsion Laboratory (JPL).  Linear Technology’s high performance analog semiconductors are used in the Mars Science Laboratory (Curiosity) rover to enable collection of vast amounts of data, including detailed visual images of the Martian landscape and precise readings to assist scientists in assessing the geology and history of Mars.


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Versatile Power announces new patent award

Versatile Power Inc.
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Versatile Power Inc. a designer and manufacturer of custom electronic subsystems, announced it has been awarded U.S. Patent Number US 8,115,366 B2, entitled “System and Method of Driving Ultrasonic Transducers” (the “Patent”), by the USPTO. This patent covers a unique method for electronically driving an ultrasonic transducer used in a variety of applications including medical, dental and many other applications requiring ultrasonic energy.


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UltraSource Inc. releases new thin film microcircuit CopperVia

UltraSource Inc.
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UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


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Rogers Corp. to display laminate solutions at DMEDS

Rogers Corp.
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Rogers Corp. will be offering a wide range of its high performance circuit board materials at the upcoming Del Mar Electronics & Design Show on May 2-3, 2012 at the Del Mar Fairgrounds in San Diego, CA. Representatives from Rogers Advanced Circuit Materials Division will be available at Booth #622 to help visitors obtain optimum performance using the company’s many different circuit board material offerings.


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