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Articles Tagged with ''circuits''
Leti and Agilent to present results on MM-wave short-range communication integrated systems IEEE SiRF
CEA-Leti and Agilent Technologies will present their recent research results in the field of embedded integrated systems at the IEEE Silicon Monolithic Integrated Circuits in RF Systems (SiRF) Conference in Austin, TX, Jan. 21-23.
Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada.
Analog Devices Inc. (ADI) introduced a multiplexed 24-bit sigma-delta A/D converter that doubles the throughput rate of alternative sigma-delta converters while dissipating less power. Designed for process automation and instrumentation systems where data channel density is increasing and channels must be monitored faster, ADI’s new AD7176-2 A/D converter achieves a 50 kSPS (thousand samples per second) multi-channel scan rate.
Agilent Technologies Inc. announced shipment of its GoldenGate 2012.10 RFIC simulation, verification and analysis software.
Rogers Corp. will be exhibiting several of its high-performance circuit materials at the upcoming electronica 2012 trade show. Scheduled for November 13-16, 2012 at the New Munich Trade Fair Centre, Munich, Germany, the 25th international electronica trade show (www.electronica.de) is a major electronics event for a wide range of business sectors, including automotive, medical, consumer, commercial, military and general wireless markets. The electronics trade show attracts press coverage from 22 countries and more than 500 technical publications.
Custom MMIC, (www.CustomMMIC.com), a developer of performance-driven monolithic microwave integrated circuits (MMICs), has launched a new website which includes information related to its growing product library of commercially available amplifiers, mixers, control devices, multipliers, and multi-function MMICs.
Researchers from A*STAR’s Institute of Microelectronics (IME) have developed the first compact high performance silicon-based cavity-backed slot (CBS) antenna that operates at 135 GHz. The antenna demonstrated 30 times stronger signal transmission over on-chip antennas at 135 GHz. At just 1.6 mm x 1.2 mm, approximately the size of a sesame seed, it is the smallest silicon-based CBS antenna reported to date for ready integration with active circuits.
Linear Technology Corp., a leading supplier of high performance analog integrated circuits, announced that its products are playing a key role in the Mars rover launched by NASA’s Jet Propulsion Laboratory (JPL). Linear Technology’s high performance analog semiconductors are used in the Mars Science Laboratory (Curiosity) rover to enable collection of vast amounts of data, including detailed visual images of the Martian landscape and precise readings to assist scientists in assessing the geology and history of Mars.
Versatile Power Inc. a designer and manufacturer of custom electronic subsystems, announced it has been awarded U.S. Patent Number US 8,115,366 B2, entitled “System and Method of Driving Ultrasonic Transducers” (the “Patent”), by the USPTO. This patent covers a unique method for electronically driving an ultrasonic transducer used in a variety of applications including medical, dental and many other applications requiring ultrasonic energy.
UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.