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Articles Tagged with ''circuits''

Keysight's Genesys 2015 software enables fastest realization of RF systems & circuits

Keysight Technologies, Inc. announced the latest release of its industry leading, affordable RF simulation and synthesis software, Genesys 2015. Designed for circuit and system designers, the software features breakthrough Keysight Sys-Parameters that enables RF system simulation with off-the-shelf component datasheets; and comprehensive RF circuit synthesis to enable the industry’s fastest realization of RF systems and circuits.


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Anokiwave names Andrew Crofts vice president of Applications

Anokiwave Inc., an innovative company providing highly integrated core IC solutions for mmW and AESA markets, announced the latest addition to its leadership team with the appointment of Andrew Crofts to the position of vice president of Applications. This appointment supports Anokiwave’s plans to extend product development by supporting new customers and applications for its portfolio of mmW products scheduled to release this fall.


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Micro-flex and thin film circuits for antennas and MIL-COM apps on display by Metrigraphics at IMS

 As today's battlefield gets more and more tactical, critical communications have never been more important. And as radios and subsystems are being pushed to become smaller and even more ruggedized, it’s causing a chain reaction right down to the circuit level. Where once rigid and thick film technologies were primary go-to solutions, today's military communication applications are requiring antennas to be even more flexible, circuits to fit into tighter spaces, and signal integrity at higher frequencies to be perfect. And to add to that, today soldiers’ vital signs are as closely monitored as a radar screen — it’s easy to understand the push towards advanced circuitry is tasking traditional thinking. 


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Remtec introduces new leadless ceramic SMT packages for optoelectronic circuits

Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has applied its time-proven leadless ceramic SMT substrate technology to the development of a new line of standard SMT leadless packages for electro optical circuits matching standard TO-type window lids.


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Advanced Microcircuit Metallization Process

 

Metallization ServicesMetrigraphics announced it has developed an advanced process for applying metal layers to circuit substrates and to polyimide layers on multilayer circuits. The process works for both rigid and flexible circuits. Metallization layers can range in thickness from 10 microns to over 100 microns. Substrates can range up to 12" x 12" or 144 square inches.


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