Cascade Microtech Inc., a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level, announced Velox 2.0, the latest version of their probe station control software. Combining the ease of Nucleus™ with the power of ProberBench™, Velox 2.0 delivers new levels of test and measurement efficiency to accelerate time to job completion.
Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has applied its time-proven leadless ceramic SMT substrate technology to the development of a new line of standard SMT leadless packages for electro optical circuits matching standard TO-type window lids.
X-REL Semiconductor, the specialist in high reliability and extreme temperature integrated circuits, has broadened its clock and timing product line by introducing a low-power, small foot-print crystal oscillator driver, XTR60010.
Metrigraphics announced it has developed an advanced process for applying metal layers to circuit substrates and to polyimide layers on multilayer circuits. The process works for both rigid and flexible circuits. Metallization layers can range in thickness from 10 microns to over 100 microns. Substrates can range up to 12” X 12” or 144 square inches.
eSurface® Technologies, the developer of the eSurface proprietary process for printed circuit boards, announced the appointment of Judy Warner to the eSurface Technologies Advisory Board, effective immediately.
Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, announced it has developed new breakthroughs in processing substrate-based ultra-miniaturized circuits. The additive processes used are an alternative to traditional chemical etching, which causes circuit lines to slope, resulting in performance variations and yield issues.
Metrigraphics announced it has achieved large-scale production of micron-scale flexible circuits six or more layers high, with traces (circuit lines) as narrow as three microns (11.81 x 10-5 inches). The circuits are so flexible they can be wrapped around objects with diameters as small as a pencil. Products include single-layer flex, multi-layer flex, coils, sensor components, and electrodes (neuro-stimulation).
Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits, is adding a new driver amplifier, the CMD192C5, to its growing product library. The CMD192C5 is the packaged version of the highly popular CMD192 amplifier that until now had only been available in die form.
Michael Casper, president & CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource Inc. is featured in the publication titled “Microwave and Millimeter-Wave Electronic Packaging” by Rick Sturdivant and published by Artech House.