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Articles Tagged with ''circuits''

Anokiwave names Andrew Crofts vice president of Applications

Anokiwave Inc., an innovative company providing highly integrated core IC solutions for mmW and AESA markets, announced the latest addition to its leadership team with the appointment of Andrew Crofts to the position of vice president of Applications. This appointment supports Anokiwave’s plans to extend product development by supporting new customers and applications for its portfolio of mmW products scheduled to release this fall.


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Micro-flex and thin film circuits for antennas and MIL-COM apps on display by Metrigraphics at IMS

 As today's battlefield gets more and more tactical, critical communications have never been more important. And as radios and subsystems are being pushed to become smaller and even more ruggedized, it’s causing a chain reaction right down to the circuit level. Where once rigid and thick film technologies were primary go-to solutions, today's military communication applications are requiring antennas to be even more flexible, circuits to fit into tighter spaces, and signal integrity at higher frequencies to be perfect. And to add to that, today soldiers’ vital signs are as closely monitored as a radar screen — it’s easy to understand the push towards advanced circuitry is tasking traditional thinking. 


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Remtec introduces new leadless ceramic SMT packages for optoelectronic circuits

Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has applied its time-proven leadless ceramic SMT substrate technology to the development of a new line of standard SMT leadless packages for electro optical circuits matching standard TO-type window lids.


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Advanced Microcircuit Metallization Process

 

Metallization ServicesMetrigraphics announced it has developed an advanced process for applying metal layers to circuit substrates and to polyimide layers on multilayer circuits. The process works for both rigid and flexible circuits. Metallization layers can range in thickness from 10 microns to over 100 microns. Substrates can range up to 12" x 12" or 144 square inches.


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Metrigraphics' additive process yields substrate-based thin film circuits

 Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, announced it has developed new breakthroughs in processing substrate-based ultra-miniaturized circuits. The additive processes used are an alternative to traditional chemical etching, which causes circuit lines to slope, resulting in performance variations and yield issues.  


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Micron-Scale Flexible Circuits

 

Flexible MicrocircuitsMetrigraphics announced it has achieved large-scale production of micron-scale flexible circuits six or more layers high, with traces (circuit lines) as narrow as three microns (11.81 x 10-5 inches). The circuits are so flexible they can be wrapped around objects with diameters as small as a pencil. Products include single-layer flex, multi-layer flex, coils, sensor components, and electrodes (neuro-stimulation).


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