advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Articles Tagged with ''wire''

Diodes added to SemiGen's RF Supply Center

October 4, 2012

SemiGen Inc. (www.semigen.net), an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, has announced the recent addition of key components to their RF Supply Center’s stockroom. The RF Supply Center is now offering PIN and limiter diodes that meet the most common RF/Microwave design specifications.


Read More

Hesse & Knipps to demo new 3 mil wire bonding capability at IMAPS 2012

August 17, 2012

Hesse & Knipps Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, will demo a new 3 mil wire bonding capability on its BJ935 Fully Automatic Heavy Wire Bonder at the upcoming 45th International Symposium on Microelectronics (IMAPS) in Booth No. 210.


Read More

Hesse & Knipps appoints new technical training manager

July 24, 2012

Hesse & Knipps Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, has appointed Allan Camp as technical training manager.


Read More

SemiGen purchases Palomar 8000 Automatic Ball Bonder

May 9, 2012

SemiGen, Inc. has announced today they have placed an order for a Palomar 8000 Auto Ball Bonder to round out their state-of-the-art RF/Microwave assembly line.


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement