Articles Tagged with ''dielectric''

Agilent Technologies Inc. announced theE5063A ENA Series network analyzer, a low-cost ENA solution for manufacturing test. The instrument offers optimized performance and functionality for testing simple RF passive components, such as handset/BTS antennas, RF cables and filters. It can also be used in R&D for evaluation of RF passive devices and dielectric materials.

Rogers Corp. will be promoting its high performance printed-circuit-board (PCB) materials at the DesignCon® 2014 expo. The event is being held January 29-30, 2014 at the Santa Clara Convention Center (Santa Clara, CA). The DesignCon 2014 Expo provides practical solutions for semiconductor and electronic design engineers from more than 150 of the top suppliers in the electronic industry.

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards, announced it had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products.

Now with the CST Webinar Series 2013 all wrapped-up, the company would like to thank all those who tuned-in live and heard its experts explore topics across the electromagnetic (EM) spectrum. 

Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announced that its 7/8” CELLFLEX® foam dielectric coaxial cable has been used in Phase 1 of BAI Canada’s project to build a shared wireless Wi-Fi and cellular infrastructure thatwill enable wirelesscommunications services for Toronto Transit Commission (TTC) riderswithin underground subway stations. The first two stations to launch on the BAI wireless platformwill be Bloor & Yonge and St. George. BAI Canada plans to bring wireless service to 65 underground stations total by 2017.

Isola Group S.à.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs), announced TerraGreen, the company’s new halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations, internet infrastructure and cloud computing.

Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).

DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications.  The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer Printed Circuit Boards (PCBs), announced Astra™, the company’s breakthrough very low-loss dielectric constant (Dk) product for millimeter wave frequencies and beyond.

Florida RF Lab's Lab-Flex® Qseries utilizes the highest grade, radiation resistant, non-outgassing materials to insure maximum life and high level performance. Construction consists of a robust, low loss, extruded PTFE dielectric housed in a triple shielded outer conductor system for maximum shielding effectiveness.