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Articles Tagged with ''dielectric''
Isola Group S.à.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs), announced TerraGreen, the company’s new halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations, internet infrastructure and cloud computing.
Rogers to offer material solutions for high-frequency, high-thermal-reliability & multilayer circuits at PCB West 2013
Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).
DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications. The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.
Isola introduces very low-loss materials for advanced automotive safety and driver assistance systems
Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer Printed Circuit Boards (PCBs), announced Astra™, the company’s breakthrough very low-loss dielectric constant (Dk) product for millimeter wave frequencies and beyond.
Florida RF Lab's Lab-Flex® Qseries utilizes the highest grade, radiation resistant, non-outgassing materials to insure maximum life and high level performance. Construction consists of a robust, low loss, extruded PTFE dielectric housed in a triple shielded outer conductor system for maximum shielding effectiveness.
Isola Group S.a.r.l.announced that its six-member IS680 copper-clad laminate family is now in production at its facility in Dueren, Germany.
Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials, will exhibit at the upcoming International Microwave Symposium (IMS) 2013 to be held in conjunction with the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, and the ARFTG Microwave Measurement Conference. The exhibition takes place June 4-7, 2013 at the Washington State Convention Center located at 800 Convention Place in Seattle.
When the IEEE International Microwave Symposium opens early next month, Laird Technologies Inc., a global technology company, will be there to showcase its best-in-class EMI and microwave materials to design engineers looking for solutions with proven results. Addressing EMI issues early in the design process is critical, and Laird’s customizable solutions are ideal for engineers working at VHF, UHF, microwave and millimeter wave frequencies in industries ranging from wireless and telecommunications to medical and military.
Rogers Corp. will highlight several of its high quality printed circuit board (PCB) materialsat the upcoming 2013 IEEE International Microwave Symposium (IMS). Rogers’ Advanced Circuit Materials representatives will be on hand at exhibition booth #1459. In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from Phase Measurements.” as part of the technical program.
Premix, the leading specialist in conductive plastics, launches the PREPERM® product family with customizable dielectric properties for high-frequency applications. The new product range provides high-frequency device manufacturers with an outstanding material that maximizes performance without increasing overall costs. PREPERM grades can be cost-effectively injection molded to high frequency antenna parts.