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Articles Tagged with ''dielectric''

Exodus Dynamics releases new ultra low noise dielectric resonator oscillator

Exodus Dynamics
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 Exodus Dynamics introduces the EDRO-1035-10.00, a 1 W, 10 GHz Ultra Low Noise Dielectric Resonator Oscillator (DRO), with TTL RF muting and variable attenuation feature. 


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Isola's RF-Substrate conversion program gains momentum

Isola Group S.a.r.l.
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 Isola Group S.a r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced a major qualification win in partnership with KSG Leiterplatten GmbH and InnoSenT GmbH


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High Speed Interconnects' multi-conductor assemblies minimize impedance mismatches

High Speed Interconnects
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High Speed Interconnects, a custom high performance cable assembly manufacturer, is introducing its MICTOR™ Multi-Conductor Cable Assemblies. These cables are precisely impedance-matched to 50-Ohm impedance (100 Ohms in differential pairs) to achieve high performance and proven reliability in lengths and configurations that ideally match a customer’s requirements.


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Isola launches CAF mitigation technology-licensing program

Isola Group S.a.r.l.
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Isola Group S.à r.l., a market leader in engineered dielectric materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced that the company has launched a technology-licensing program to mitigate conductive anodic filamentation (CAF) problems in the fabrication of PCBs. This proprietary manufacturing technology, which is offered by ISOLA USA Corp. 


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Agilent announces ENA Series network analyzer that reduces cost, optimizes test of RF components

Agilent Technologies Inc., Santa Clara, CA
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Agilent Technologies Inc. announced theE5063A ENA Series network analyzer, a low-cost ENA solution for manufacturing test. The instrument offers optimized performance and functionality for testing simple RF passive components, such as handset/BTS antennas, RF cables and filters. It can also be used in R&D for evaluation of RF passive devices and dielectric materials.


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Rogers highlights materials high performance circuits at DesignCon 2014

Rogers Corp.
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Rogers Corp. will be promoting its high performance printed-circuit-board (PCB) materials at the DesignCon® 2014 expo. The event is being held January 29-30, 2014 at the Santa Clara Convention Center (Santa Clara, CA). The DesignCon 2014 Expo provides practical solutions for semiconductor and electronic design engineers from more than 150 of the top suppliers in the electronic industry.


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Isola expands commercial production of I-Speed PCB materials into Asia

Isola Group S.a.r.l.
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Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards, announced it had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products.


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CST discusses Webinar Series 2013: Skills for Electromagnetic Simulation

Computer Simulation Technology (CST)
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Now with the CST Webinar Series 2013 all wrapped-up, the company would like to thank all those who tuned-in live and heard its experts explore topics across the electromagnetic (EM) spectrum. 


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RFS supports BAI Canada's wireless infrastructure for underground subway stations

Radio Frequency Systems
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Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announced that its 7/8” CELLFLEX® foam dielectric coaxial cable has been used in Phase 1 of BAI Canada’s project to build a shared wireless Wi-Fi and cellular infrastructure thatwill enable wirelesscommunications services for Toronto Transit Commission (TTC) riderswithin underground subway stations. The first two stations to launch on the BAI wireless platformwill be Bloor & Yonge and St. George. BAI Canada plans to bring wireless service to 65 underground stations total by 2017.


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Isola introduces halogen-free, ultra-low loss materials

Isola Group S.a.r.l.
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Isola Group S.à.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs), announced TerraGreen, the company’s new halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations, internet infrastructure and cloud computing.


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