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Articles Tagged with ''dielectric''

High Speed Interconnects' multi-conductor assemblies minimize impedance mismatches

April 16, 2014

High Speed Interconnects, a custom high performance cable assembly manufacturer, is introducing its MICTOR™ Multi-Conductor Cable Assemblies. These cables are precisely impedance-matched to 50-Ohm impedance (100 Ohms in differential pairs) to achieve high performance and proven reliability in lengths and configurations that ideally match a customer’s requirements.


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Isola launches CAF mitigation technology-licensing program

April 9, 2014

Isola Group S.à r.l., a market leader in engineered dielectric materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced that the company has launched a technology-licensing program to mitigate conductive anodic filamentation (CAF) problems in the fabrication of PCBs. This proprietary manufacturing technology, which is offered by ISOLA USA Corp. 


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Agilent announces ENA Series network analyzer that reduces cost, optimizes test of RF components

February 4, 2014

Agilent Technologies Inc. announced theE5063A ENA Series network analyzer, a low-cost ENA solution for manufacturing test. The instrument offers optimized performance and functionality for testing simple RF passive components, such as handset/BTS antennas, RF cables and filters. It can also be used in R&D for evaluation of RF passive devices and dielectric materials.


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Rogers highlights materials high performance circuits at DesignCon 2014

January 21, 2014

Rogers Corp. will be promoting its high performance printed-circuit-board (PCB) materials at the DesignCon® 2014 expo. The event is being held January 29-30, 2014 at the Santa Clara Convention Center (Santa Clara, CA). The DesignCon 2014 Expo provides practical solutions for semiconductor and electronic design engineers from more than 150 of the top suppliers in the electronic industry.


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Isola expands commercial production of I-Speed PCB materials into Asia

December 16, 2013

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards, announced it had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products.


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CST discusses Webinar Series 2013: Skills for Electromagnetic Simulation

December 12, 2013

Now with the CST Webinar Series 2013 all wrapped-up, the company would like to thank all those who tuned-in live and heard its experts explore topics across the electromagnetic (EM) spectrum. 


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RFS supports BAI Canada's wireless infrastructure for underground subway stations

December 11, 2013

Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announced that its 7/8” CELLFLEX® foam dielectric coaxial cable has been used in Phase 1 of BAI Canada’s project to build a shared wireless Wi-Fi and cellular infrastructure thatwill enable wirelesscommunications services for Toronto Transit Commission (TTC) riderswithin underground subway stations. The first two stations to launch on the BAI wireless platformwill be Bloor & Yonge and St. George. BAI Canada plans to bring wireless service to 65 underground stations total by 2017.


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Isola introduces halogen-free, ultra-low loss materials

September 25, 2013

Isola Group S.à.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs), announced TerraGreen, the company’s new halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations, internet infrastructure and cloud computing.


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Rogers to offer material solutions for high-frequency, high-thermal-reliability & multilayer circuits at PCB West 2013

September 17, 2013

Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).


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DuPont Circuit & Packaging Materials and IQLP to develop high-speed circuit technology

August 12, 2013

DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications.  The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.


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