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Articles Tagged with ''thermal''

Linear's 140 V precision op amp features 3 pA bias current, 3.5 µVP-P noise

Linear Technology announces the LTC6090, a precision operational amplifier that operates on a supply voltage up to 140 V (or ±70 V). Its combination of rail-to-rail output, 3 pA (typical) input bias current, 1.6 mV maximum input offset voltage and 3.5 µVP-P low frequency noise delivers the precision required for high performance ATE, piezo driver, and DAC buffer applications.


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inTEST launches THERMOSTREAM ATS Series

inTEST Corp., an independent designer, manufacturer and marketer of temperature management products and semiconductor automatic test equipment (ATE) interface solutions, announced that its Thermal Solutions Group has launched the industry’s most comprehensive line of Precision Temperature Forcing Systems, the THERMOSTREAM® ATS Series. With temperature range extremes as high as +300ºC (+570ºF) and as low as -100ºC (-148ºF), countless test and conditioning applications can now be solved with a compact, precise and portable system.


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Rogers to show high-performance laminates and bondply materials at electronica 2012

Rogers Corp. will be exhibiting several of its high-performance circuit materials at the upcoming electronica 2012 trade show. Scheduled for November 13-16, 2012 at the New Munich Trade Fair Centre, Munich, Germany, the 25th international electronica trade show (www.electronica.de) is a major electronics event for a wide range of business sectors, including automotive, medical, consumer, commercial, military and general wireless markets. The electronics trade show attracts press coverage from 22 countries and more than 500 technical publications.


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StratEdge introduces laminate packages for high power devices

StratEdge Corp., a designer and producer of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, introduces a new family of high power laminate packages at IMS2012 Booth #1625. The LL family of leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).


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