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Articles Tagged with ''thermal''

Laird Technologies to exhibit wireless solutions at CTIA 2013

Laird Technologies Inc., a global technology company, will exhibit solutions for the wirelessly connected world at CTIA 2013. Embedded wireless, active thermal management and telematics products will be on display, allowing Laird to showcase a range of wireless capabilities. The CTIA Conference and Exhibition will be held at the Sands Expo and Convention Center in Las Vegas, May 21-23. Laird will exhibit at booth #6136.  


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API Technologies expands high performance PA line

API Technologies Corp., a provider of RF/microwave, microelectronics, and security solutions for critical and high-reliability applications, has expanded its power amplifier line of products to include the latest in GaN technology driven designs. This expanded line is specially intended for use in electronic warfare, RCIED countermeasures, and national security jammer applications where the use of rugged and highly reliable power amplifier designs is mission critical.


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Linear's 140 V precision op amp features 3 pA bias current, 3.5 µVP-P noise

Linear Technology announces the LTC6090, a precision operational amplifier that operates on a supply voltage up to 140 V (or ±70 V). Its combination of rail-to-rail output, 3 pA (typical) input bias current, 1.6 mV maximum input offset voltage and 3.5 µVP-P low frequency noise delivers the precision required for high performance ATE, piezo driver, and DAC buffer applications.


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inTEST launches THERMOSTREAM ATS Series

inTEST Corp., an independent designer, manufacturer and marketer of temperature management products and semiconductor automatic test equipment (ATE) interface solutions, announced that its Thermal Solutions Group has launched the industry’s most comprehensive line of Precision Temperature Forcing Systems, the THERMOSTREAM® ATS Series. With temperature range extremes as high as +300ºC (+570ºF) and as low as -100ºC (-148ºF), countless test and conditioning applications can now be solved with a compact, precise and portable system.


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Rogers to show high-performance laminates and bondply materials at electronica 2012

Rogers Corp. will be exhibiting several of its high-performance circuit materials at the upcoming electronica 2012 trade show. Scheduled for November 13-16, 2012 at the New Munich Trade Fair Centre, Munich, Germany, the 25th international electronica trade show (www.electronica.de) is a major electronics event for a wide range of business sectors, including automotive, medical, consumer, commercial, military and general wireless markets. The electronics trade show attracts press coverage from 22 countries and more than 500 technical publications.


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