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Articles Tagged with ''thermal''

AWR’s schedule of activities at MWE 2012

November 27, 2012

What: AWR is offering an array of software demonstrations, lectures, and partner presentations at the Microwave Workshops and Exhibition 2012 (MWE2012) in Yokohama, Japan from November 28 through November 30.


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Lockheed Martin completes critical test on GPS III Pathfinder

MarketWatch: Defense
November 21, 2012

The Lockheed Martin team developing the U.S. Air Force’s next generation Global Positioning System III satellites has completed thermal vacuum testing for the Navigation Payload Element (NPE) of the GPS III Non-Flight Satellite Testbed (GNST). 


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Rogers to show high-performance laminates and bondply materials at electronica 2012

November 12, 2012

Rogers Corp. will be exhibiting several of its high-performance circuit materials at the upcoming electronica 2012 trade show. Scheduled for November 13-16, 2012 at the New Munich Trade Fair Centre, Munich, Germany, the 25th international electronica trade show (www.electronica.de) is a major electronics event for a wide range of business sectors, including automotive, medical, consumer, commercial, military and general wireless markets. The electronics trade show attracts press coverage from 22 countries and more than 500 technical publications.


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Richardson RFPD introduces two new wideband LDMOS transistors from Freescale

June 29, 2012

Richardson RFPD Inc. announces immediate availability and full design support capabilities for two new laterally diffused metal oxide semiconductor (LDMOS) transistors from Freescale Semiconductor Inc. (Freescale).


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StratEdge introduces laminate packages for high power devices

June 13, 2012

StratEdge Corp., a designer and producer of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, introduces a new family of high power laminate packages at IMS2012 Booth #1625. The LL family of leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).


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UltraSource Inc. releases new thin film microcircuit CopperVia

June 7, 2012

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


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Richardson RFPD and PriaTherm sign European distribution deal

May 1, 2012

Richardson RFPD Inc. announces it has completed a distribution agreement with PriaTherm, a European-based provider of reliable and innovative solutions in the thermal management industry. With this agreement, Priatherm provides Richardson RFPD with a source to assist its European customers with fabricated heat sinks for high power RF, as well as energy and power management, applications.


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Rogers Corp. to display laminate solutions at DMEDS

April 18, 2012

Rogers Corp. will be offering a wide range of its high performance circuit board materials at the upcoming Del Mar Electronics & Design Show on May 2-3, 2012 at the Del Mar Fairgrounds in San Diego, CA. Representatives from Rogers Advanced Circuit Materials Division will be available at Booth #622 to help visitors obtain optimum performance using the company’s many different circuit board material offerings.


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Mentor Graphics launches latest suite of analysis tools

February 1, 2012
Mentor Graphics Corp. announced the release of version 8.2 of the HyperLynx® suite of analysis tools offering significant new functionality for optimizing printed circuit board (PCB) designs, including 3D full-wave field solving and integrated thermal/power co-simulation analysis capabilities.
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