advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Articles Tagged with ''thermal''

Linear's 140 V precision op amp features 3 pA bias current, 3.5 µVP-P noise

Linear Technology announces the LTC6090, a precision operational amplifier that operates on a supply voltage up to 140 V (or ±70 V). Its combination of rail-to-rail output, 3 pA (typical) input bias current, 1.6 mV maximum input offset voltage and 3.5 µVP-P low frequency noise delivers the precision required for high performance ATE, piezo driver, and DAC buffer applications.


Read More

Laird Technologies releases two new Tflex™ Series products

Laird Technologies Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced the release of two new Tflex™ series thermal gap fillers.  


Read More

inTEST launches THERMOSTREAM ATS Series

inTEST Corp., an independent designer, manufacturer and marketer of temperature management products and semiconductor automatic test equipment (ATE) interface solutions, announced that its Thermal Solutions Group has launched the industry’s most comprehensive line of Precision Temperature Forcing Systems, the THERMOSTREAM® ATS Series. With temperature range extremes as high as +300ºC (+570ºF) and as low as -100ºC (-148ºF), countless test and conditioning applications can now be solved with a compact, precise and portable system.


Read More

Maury Microwave launches low-profile and TVAC Stability cable assemblies

Maury Microwave announces the expansion of its Stability™ family of amplitude- and phase-stable cable assemblies to include Low-Profile (-LP) and Thermal Vacuum (-TVAC) models.


Read More

AWR’s schedule of activities at MWE 2012

What: AWR is offering an array of software demonstrations, lectures, and partner presentations at the Microwave Workshops and Exhibition 2012 (MWE2012) in Yokohama, Japan from November 28 through November 30.


Read More

Lockheed Martin completes critical test on GPS III Pathfinder

MarketWatch: Defense

The Lockheed Martin team developing the U.S. Air Force’s next generation Global Positioning System III satellites has completed thermal vacuum testing for the Navigation Payload Element (NPE) of the GPS III Non-Flight Satellite Testbed (GNST). 


Read More

Rogers to show high-performance laminates and bondply materials at electronica 2012

Rogers Corp. will be exhibiting several of its high-performance circuit materials at the upcoming electronica 2012 trade show. Scheduled for November 13-16, 2012 at the New Munich Trade Fair Centre, Munich, Germany, the 25th international electronica trade show (www.electronica.de) is a major electronics event for a wide range of business sectors, including automotive, medical, consumer, commercial, military and general wireless markets. The electronics trade show attracts press coverage from 22 countries and more than 500 technical publications.


Read More

Richardson RFPD introduces two new wideband LDMOS transistors from Freescale

Richardson RFPD Inc. announces immediate availability and full design support capabilities for two new laterally diffused metal oxide semiconductor (LDMOS) transistors from Freescale Semiconductor Inc. (Freescale).


Read More

StratEdge introduces laminate packages for high power devices

StratEdge Corp., a designer and producer of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, introduces a new family of high power laminate packages at IMS2012 Booth #1625. The LL family of leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).


Read More

UltraSource Inc. releases new thin film microcircuit CopperVia

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement