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Articles Tagged with ''thermal''
inTEST Corp., an independent designer, manufacturer and marketer of temperature management products and semiconductor automatic test equipment (ATE) interface solutions, announced that its Thermal Solutions Group has launched the industry’s most comprehensive line of Precision Temperature Forcing Systems, the THERMOSTREAM® ATS Series. With temperature range extremes as high as +300ºC (+570ºF) and as low as -100ºC (-148ºF), countless test and conditioning applications can now be solved with a compact, precise and portable system.
Maury Microwave announces the expansion of its Stability™ family of amplitude- and phase-stable cable assemblies to include Low-Profile (-LP) and Thermal Vacuum (-TVAC) models.
What: AWR is offering an array of software demonstrations, lectures, and partner presentations at the Microwave Workshops and Exhibition 2012 (MWE2012) in Yokohama, Japan from November 28 through November 30.
The Lockheed Martin team developing the U.S. Air Force’s next generation Global Positioning System III satellites has completed thermal vacuum testing for the Navigation Payload Element (NPE) of the GPS III Non-Flight Satellite Testbed (GNST).
Rogers Corp. will be exhibiting several of its high-performance circuit materials at the upcoming electronica 2012 trade show. Scheduled for November 13-16, 2012 at the New Munich Trade Fair Centre, Munich, Germany, the 25th international electronica trade show (www.electronica.de) is a major electronics event for a wide range of business sectors, including automotive, medical, consumer, commercial, military and general wireless markets. The electronics trade show attracts press coverage from 22 countries and more than 500 technical publications.
Richardson RFPD Inc. announces immediate availability and full design support capabilities for two new laterally diffused metal oxide semiconductor (LDMOS) transistors from Freescale Semiconductor Inc. (Freescale).
StratEdge Corp., a designer and producer of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, introduces a new family of high power laminate packages at IMS2012 Booth #1625. The LL family of leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).
UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.
Richardson RFPD Inc. announces it has completed a distribution agreement with PriaTherm, a European-based provider of reliable and innovative solutions in the thermal management industry. With this agreement, Priatherm provides Richardson RFPD with a source to assist its European customers with fabricated heat sinks for high power RF, as well as energy and power management, applications.
Rogers Corp. will be offering a wide range of its high performance circuit board materials at the upcoming Del Mar Electronics & Design Show on May 2-3, 2012 at the Del Mar Fairgrounds in San Diego, CA. Representatives from Rogers Advanced Circuit Materials Division will be available at Booth #622 to help visitors obtain optimum performance using the company’s many different circuit board material offerings.