Articles Tagged with ''materials''

Rogers Corp. exhibited and presented a white paper concerning thermal conductivity at the DesignCon 2012 conference and exhibition. DesignCon, held January 31 through February 1, 2012, at the Santa Clara Convention Center, Santa Clara, Calif., is one of the electronic industry’s key meeting places for printed-circuit-board (PCB) designers.

RFMW now supports the Doupler, a new component that integrates a directional coupler in parallel with a hybrid combiner.