Articles Tagged with ''materials''

Indium Corp.'s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore. 

Peregrine Semiconductor Corp. announces the UltraCMOS 10 platform, the newest advancement in Peregrine’s UltraCMOS technology. UltraCMOS 10 RF SOI delivers both flexibility and unparalleled performance for addressing the ever-increasing challenges of RF front-end design.

LPKF Laser & Electronics has announced the availability of a new, higher-powered laser source option for its MicroLine family of UV laser circuit board depaneling systems.

In response to positive feedback heard at the recent IRMMW-THz conference, Lake Shore Cryotronics announced that it is moving forward with implementing software features that will further enhance the usability of its prototype terahertz (THz) materials characterization platform.

Park Electrochemical Corp. announced the introduction of its new NL9000 RF/Microwave electronics materials products. NL9000 materials are available globally. They have a dissipation factor (“Df”) of 0.0017 at 10 GHz using stripline testing methodology and a 0.5 dB/cm attenuation loss at 77 GHz for microstrip automotive radar applications.

Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).

Lake Shore Cryotronics will exhibit its materials characterization solutions, including its prototype terahertz (THz) system, at booth 623 at SPIE Optics + Photonics, August 27­­­-29 in San Diego. In addition to the new THz system, Lake Shore offers probe stations and Hall measurement systems (HMS) for complex measurements under variable temperature and magnetic field conditions.

DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications.  The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer Printed Circuit Boards (PCBs), announced Astra™, the company’s breakthrough very low-loss dielectric constant (Dk) product for millimeter wave frequencies and beyond.