- Buyers Guide
Articles Tagged with ''materials''
Isola Group S.á.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer printed circuit boards (PCBs), announced today that its plant in Suzhou, China has received ISO/TS 16949 certification. This is the company's third such certification, which represents the highest international quality standard for the automotive industry. Isola's plants located in Duren, Germany and Huizhou, China are similarly certified. The certification of the Suzhou facility is a significant achievement in the company's strategic roadmap to further its presence in the automotive market.
Soitec (Euronext) and SunEdison Inc. announced that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products. The agreement provides each company with access to the other’s patent portfolio for SOI technologies and ends all outstanding legal disputes between the companies.
Indium Corp.'s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.
Peregrine Semiconductor Corp. announces the UltraCMOS 10 platform, the newest advancement in Peregrine’s UltraCMOS technology. UltraCMOS 10 RF SOI delivers both flexibility and unparalleled performance for addressing the ever-increasing challenges of RF front-end design.
LPKF Laser & Electronics has announced the availability of a new, higher-powered laser source option for its MicroLine family of UV laser circuit board depaneling systems.
In response to positive feedback heard at the recent IRMMW-THz conference, Lake Shore Cryotronics announced that it is moving forward with implementing software features that will further enhance the usability of its prototype terahertz (THz) materials characterization platform.
Park Electrochemical Corp. announced the introduction of its new NL9000 RF/Microwave electronics materials products. NL9000 materials are available globally. They have a dissipation factor (“Df”) of 0.0017 at 10 GHz using stripline testing methodology and a 0.5 dB/cm attenuation loss at 77 GHz for microstrip automotive radar applications.
Rogers to offer material solutions for high-frequency, high-thermal-reliability & multilayer circuits at PCB West 2013
Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).
Lake Shore Cryotronics will exhibit its materials characterization solutions, including its prototype terahertz (THz) system, at booth 623 at SPIE Optics + Photonics, August 27-29 in San Diego. In addition to the new THz system, Lake Shore offers probe stations and Hall measurement systems (HMS) for complex measurements under variable temperature and magnetic field conditions.