Rogers Corp. introduces RO4730G3™ UL 94 V-0 antenna-grade laminates to meet present and future performance requirements in active antenna arrays and small cells, notably in 4G base transceiver stations (BTS) and Internet of Things (IoT) applications as well as emerging 5G wireless systems.
Rogers Corp. is exhibiting at the 2016 IEEE MTT-S International Microwave Symposium (IMS) May 24-26, at the Moscone Center in San Francisco, Calif., Booth #2039. IEEE MTT-S IMS is the microwave industry’s largest international gathering of RF/microwave professionals, with over 600 exhibition booths and more than 8,000 attendees expected.
Rogers Corp. will be exhibiting at the upcoming IPC APEX Expo scheduled for March 15-17 at the Las Vegas Convention Center, Las Vegas, Nev. Representatives from Rogers Corp. will be exhibiting at Booth #607, providing information and insight on the use of their circuit materials, including ULTRALAM® 3850HT, CLTE-XT™, TC350™ RO3003™ and XT/duroid® laminates. Rogers will also be previewing its new material system developed for extremely low loss digital applications.
Rogers Corp. will be exhibiting and educating at the upcoming DesignCon show. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center in Santa Clara, Calif.
Rogers Corp. will be a major participant in the conference and product exhibition segments of Europe’s largest trade show devoted to RF/microwave technology and applications-- European Microwave Week 2015 (EuMW 2015).
Amphenol Invotec Ltd. has gained approval from Underwriters Laboratories for I-Tera®MT; a very low loss laminate, developed for high speed applications. I-Tera®MT laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
Rogers Corp., a global technology leader in the development of high performance printed circuit materials, announced that its division previously known as Advanced Circuit Materials is changing its name to Advanced Connectivity Solutions (ACS)
Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), will exhibit in booth #1135 at the IEEE MTT International Microwave Symposium (IMS) 2015, which will be held in conjunction with the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium and the ARFTG Microwave Measurement Conference.