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Articles Tagged with ''materials''

ARC Technologies launches AC2ES: ARC clear conductive electromagnetic shielding

ARC Technologies
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 ARC Technologies is excited to announce the launch of AC2ES (ARC Clear Conductive Electromagnetic Shielding). 


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Rogers Corp. introduces RO3000 laminates with rolled copper foils

Rogers Corp.
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 Rogers Corp.’s Advanced Circuit Materials Division, a global leader in Microwave Printed Circuit Board (PCB) Materials, recently introduced rolled copper cladding options with its RO3003™, RO3035™ and RO3203™ low dielectric constant laminate materials 


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Isola announces compliance with European Space Agency Base-material standard

Isola Group S.a.r.l.
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 Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced that its European subsidiary, Isola GmbH, complies with the European Space Agency’s (ESA) specification for a cleaner class of base materials.  


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Lake Shore to discuss THz characterization and high-frequency probing at IRMMW-THz

Lake Shore Cryotronics
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 Lake Shore Cryotronics, a leading innovator in solutions for measurement over a wide range of temperature and magnetic field conditions, announced that it will be exhibiting solutions for high-frequency material characterization at the 39th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Sept. 14–19, in Tucson, Ariz. 


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Indium Corp. announces new vice president of operations

Indium Corp.
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 Indium Corp. announces that Brian Reid has joined the company as vice president of operations. Reid is responsible for managing operations to achieve superior productivity, efficiency, quality, capability, and delivery. 


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Lake Shore IMS exhibit to feature high-frequency probing and characterization technology

Lake Shore Cryotronics
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Lake Shore Cryotronics, a leading innovator in solutions for measurement over a wide range of temperature and magnetic field conditions, announces that it will be exhibiting at the June 3–5 IEEE MTT International Microwave Symposium (IMS) in Tampa Bay, Fla., where it will discuss platforms that enable the study of devices and materials using high-frequency measurements.


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Rogers’ advanced circuit-material solutions to be on display at IMS

Rogers Corp.
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Rogers Corp. and representatives of the company’s Advanced Circuit Materials division (ACM) will be present at the 2014 IEEE International Microwave Symposium (IMS) June 3-5 to help attendees learn more about Rogers' wide range of high frequency circuit materials.


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Indium Corp. VP of technology to present at ECTC

Indium Corp.
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Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Electronic Components and Technology Conference (ECTC) May 27-30 in Lake Buena Vista, Florida. 


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Rogers to exhibit high performance materials at Del Mar Electronics Show

Rogers Corp.
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Rogers Corp. will be showing samples of the company’s wide range of industry-leading printed-circuit-board (PCB) materials at the Del Mar Electronics & Design Show April 30-May 1, 2014 at the Del Mar Fairgrounds in San Diego, CA.


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High Speed Interconnects' multi-conductor assemblies minimize impedance mismatches

High Speed Interconnects
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High Speed Interconnects, a custom high performance cable assembly manufacturer, is introducing its MICTOR™ Multi-Conductor Cable Assemblies. These cables are precisely impedance-matched to 50-Ohm impedance (100 Ohms in differential pairs) to achieve high performance and proven reliability in lengths and configurations that ideally match a customer’s requirements.


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