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Articles Tagged with ''materials''

Isola introduces certification program for PCB fabricators

March 26, 2014

Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced that it has launched a new certification program for PCB fabricators. The program is open to qualifying fabricators in the United States able to demonstrate the ability to process such high-speed digital materials as Isola’s I-Tera MT and I-Speed.


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Richardson RFPD introduces 400L Series precision tolerance, thin film NPO RF microwave capacitors from ATC

March 14, 2014

Richardson RFPD Inc. announces immediate availability and full design support capabilities of the 400L Series of precision tolerance, thin film NPO RF and microwave capacitors from American Technical Ceramics Corp. (ATC).


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Rogers highlights latest circuit materials & PCB techniques at IPC APEX EXPO

March 6, 2014

Rogers Corp. will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, being held March 25-27, 2014 at the Mandalay Bay Resort & Convention Center (Las Vegas, NV). The IPC APEX EXPO, with more than 400 exhibiting companies and thousands of attendees, is a leading industry event for professionals involved in PCB design and manufacturing and electronic assembly and test.


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Lake Shore to discuss new 8500 Series THz system for material characterization at APS

February 21, 2014

Lake Shore Cryotronics, a leading innovator in solutions for measurement over a wide range of temperature and magnetic field conditions, announced that it will be discussing its soon-to-released terahertz (THz) system for materials characterization at the upcoming American Physical Society March Meeting in Denver.


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Conductive Rubber: What it is and where it's used

February 20, 2014

RFMW Ltd., announces the availability of a new white paper explaining the properties and advantages of various conductive rubber materials for use in RFI/EMI mitigation.


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Isola expands production of GETEK materials in Germany to support european OEMs

February 18, 2014

Isola Group S.à r.l., a market leader in dielectric materials used to fabricate advanced multilayer printed circuit boards, announced that GETEK® laminates and prepegs are now in production at its facility in Düren, Germany, which will shorten lead times to Isola’s European customers. GETEK materials provide the low-dielectric constant and low-dissipation factors  demanded by high-speed, low-loss printed circuit board designs and applications, while providing superior thermal performance and high reliability based on the system’s 180°C glass transition temperature (Tg).


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Agilent installs atomic force microscope at Cambridge Graphene Centre

January 27, 2014

Agilent Technologies announced the recent installation of an Agilent 5600LS atomic force microscope with scanning microwave microscopy at the Cambridge Graphene Centre (CGC), in the UK.


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Rogers highlights materials high performance circuits at DesignCon 2014

January 21, 2014

Rogers Corp. will be promoting its high performance printed-circuit-board (PCB) materials at the DesignCon® 2014 expo. The event is being held January 29-30, 2014 at the Santa Clara Convention Center (Santa Clara, CA). The DesignCon 2014 Expo provides practical solutions for semiconductor and electronic design engineers from more than 150 of the top suppliers in the electronic industry.


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Isola's Suzhou plant receives ISO/TS 16949 certification

December 12, 2013

Isola Group S.á.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer printed circuit boards (PCBs), announced today that its plant in Suzhou, China has received ISO/TS 16949 certification. This is the company's third such certification, which represents the highest international quality standard for the automotive industry. Isola's plants located in Duren, Germany and Huizhou, China are similarly certified. The certification of the Suzhou facility is a significant achievement in the company's strategic roadmap to further its presence in the automotive market.


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Soitec and SunEdison enter into patent license agreement

November 27, 2013

Soitec (Euronext) and SunEdison Inc. announced that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products. The agreement provides each company with access to the other’s patent portfolio for SOI technologies and ends all outstanding legal disputes between the companies.


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