Rogers Corp. will be exhibiting and educating at the upcoming DesignCon show. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center in Santa Clara, Calif.
Rogers Corp. will be a major participant in the conference and product exhibition segments of Europe’s largest trade show devoted to RF/microwave technology and applications-- European Microwave Week 2015 (EuMW 2015).
Amphenol Invotec Ltd. has gained approval from Underwriters Laboratories for I-Tera®MT; a very low loss laminate, developed for high speed applications. I-Tera®MT laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
Rogers Corp., a global technology leader in the development of high performance printed circuit materials, announced that its division previously known as Advanced Circuit Materials is changing its name to Advanced Connectivity Solutions (ACS)
Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), will exhibit in booth #1135 at the IEEE MTT International Microwave Symposium (IMS) 2015, which will be held in conjunction with the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium and the ARFTG Microwave Measurement Conference.
Indium Corp. has hired two new engineering managers, Carmen Salvatore and (James) Jung Jin-Young. Salvatore will provide leadership and direction to the engineering team at the company’s Business Park Drive facility in Utica, N.Y. Jung will oversee the engineering and quality teams at the company’s facility in Cheongju, Korea.
Rogers Corp. unveiled its ULTRALAM® 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, ULTRALAM 3850HT circuit materials are adhesiveless laminates that use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications.
Rogers Corp. will be showing samples of the company’s wide range of industry-leading printed-circuit-board (PCB) materials at DesignCon January 28-29, 2015 at the Santa Clara Convention Center in Santa Clara, Calif.