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Articles Tagged with ''materials''

Rogers Corp. to exhibit and educate at DesignCon 2016

Rogers Corp. will be exhibiting and educating at the upcoming DesignCon show. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center in Santa Clara, Calif.


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Isola to participate in International Microwave Symposium IMS2015

Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), will exhibit in booth #1135 at the IEEE MTT International Microwave Symposium (IMS) 2015, which will be held in conjunction with the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium and the ARFTG Microwave Measurement Conference.

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Indium Corp. expands engineering team

Indium Corp. has hired two new engineering managers, Carmen Salvatore and (James) Jung Jin-Young. Salvatore will provide leadership and direction to the engineering team at the company’s Business Park Drive facility in Utica, N.Y. Jung will oversee the engineering and quality teams at the company’s facility in Cheongju, Korea.


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Liquid-Crystal-Polymer Laminates: ULTRALAM 3850HT

Rogers Corp. unveiled its ULTRALAM® 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, ULTRALAM 3850HT circuit materials are adhesiveless laminates that use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications.


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