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Articles Tagged with ''silicon''

MACOM announces IP licensing program for GaN-on-Si technology

RFIC
March 31, 2014

MACOM announced an IP licensing program for Gallium Nitride (GaN) on silicon technology.  MACOM detailed recent progress in two areas critical to realizing its future vision of enabling the mainstream adoption of GaN as a large-scale RF semiconductor technology across the industry.


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Sonnet introduces Blink, the first full-wave multi-solver suite for on-chip passive device modeling

Software/EDA
March 11, 2014

Sonnet Software Inc. introduces Blink™, the first multi-solver passive device modeling suite, now available for purchase. Blink operates entirely from within the Cadence® Virtuoso® environment and is used for the analysis of on-chip passive devices such as spiral inductors and MIM capacitors.


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Richardson RFPD at APEC 2014

March 4, 2014

Richardson RFPD Inc. announces its attendance and participation at the 2014 Applied Power Electronics Conference and Exposition (APEC). APEC focuses on the practical and applied aspects of the power electronics business, and it draws attendance from all facets of the industry, from manufacturers, designers and suppliers, to individuals involved in marketing and sales.


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Soitec and SunEdison enter into patent license agreement

November 27, 2013

Soitec (Euronext) and SunEdison Inc. announced that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products. The agreement provides each company with access to the other’s patent portfolio for SOI technologies and ends all outstanding legal disputes between the companies.


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Richardson RFPD introduces industry's first 1700V SiC MOSFET from Cree

November 4, 2013

Richardson RFPD Inc. announces the availability of the industry's first 1Ω, 1700V Silicon Carbide (SiC) metal oxide semiconductor (MOSFET) from Cree Inc. (Cree).


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Twenty year Intel veteran joins Spectra7

June 14, 2013

Spectra7 Microsystems Inc., a high performance analog semiconductor company delivering unprecedented speed, resolution and signal fidelity to consumer and wireless infrastructure products, is pleased to announce that it has appointed Guy Anthony as Chief Financial Officer (CFO), effective June 17th, 2013. Anthony succeeds outgoing CFO Patrick Leung who is leaving Spectra7 to pursue other opportunities.


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Richardson RFPD offers new SiC six-pack power module from Cree

June 12, 2013

Richardson RFPD Inc. announces the availability of the new Silicon Carbide (SiC) six-pack (three phase) power module from Cree Inc. (Cree).

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Market for GaN and SiC semiconductors set to rise 18x from 2012 to 2022

April 30, 2013

The emerging market for Silicon Carbide (SiC) and Gallium Nitride (GaN) power semiconductors is forecast to grow a remarkable factor of 18 during the next 10 years, energized by demand from power supplies, photovoltaic (PV) inverters and industrial motor drives.


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