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Articles Tagged with ''silicon''

Silicon Labs launches sixth generation of industry-leading silicon TV tuners

Silicon Labs, the leading provider of silicon TV tuners, introduced the sixth generation of its high-performance, field-proven TV tuner ICs. Silicon Labs’ new Si2151 and Si2141 TV tuners address the global hybrid TV and digital TV markets, support both digital and analog video broadcasts and comply with all worldwide terrestrial/cable TV standards. 


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New Cree GaN HEMT die available via distribution

 Cree, Inc. has made seven new GaN HEMT die available through distribution via Mouser. Manufactured on silicon carbide (SiC) substrates using a either 0.4 or 0.25 μm gate length fabrication process, the gallium nitride (GaN) high electron mobility transistor (HEMT) die exhibit superior performance properties compared to silicon (Si) or gallium arsenide (GaAs) die, including: higher breakdown voltage, higher saturated electron drift velocity, higher thermal conductivity, and higher efficiency. 


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Challenging the Status Quo

The Industry’s Next Tipping Point

MACOM announces IP licensing program for GaN-on-Si technology

RFIC

MACOM announced an IP licensing program for Gallium Nitride (GaN) on silicon technology.  MACOM detailed recent progress in two areas critical to realizing its future vision of enabling the mainstream adoption of GaN as a large-scale RF semiconductor technology across the industry.


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Sonnet introduces Blink, the first full-wave multi-solver suite for on-chip passive device modeling

Software/EDA

Sonnet Software Inc. introduces Blink™, the first multi-solver passive device modeling suite, now available for purchase. Blink operates entirely from within the Cadence® Virtuoso® environment and is used for the analysis of on-chip passive devices such as spiral inductors and MIM capacitors.


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Richardson RFPD at APEC 2014

Richardson RFPD Inc. announces its attendance and participation at the 2014 Applied Power Electronics Conference and Exposition (APEC). APEC focuses on the practical and applied aspects of the power electronics business, and it draws attendance from all facets of the industry, from manufacturers, designers and suppliers, to individuals involved in marketing and sales.


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Soitec and SunEdison enter into patent license agreement

Soitec (Euronext) and SunEdison Inc. announced that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products. The agreement provides each company with access to the other’s patent portfolio for SOI technologies and ends all outstanding legal disputes between the companies.


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Richardson RFPD introduces industry's first 1700V SiC MOSFET from Cree

Richardson RFPD Inc. announces the availability of the industry's first 1Ω, 1700V Silicon Carbide (SiC) metal oxide semiconductor (MOSFET) from Cree Inc. (Cree).


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Twenty year Intel veteran joins Spectra7

Spectra7 Microsystems Inc., a high performance analog semiconductor company delivering unprecedented speed, resolution and signal fidelity to consumer and wireless infrastructure products, is pleased to announce that it has appointed Guy Anthony as Chief Financial Officer (CFO), effective June 17th, 2013. Anthony succeeds outgoing CFO Patrick Leung who is leaving Spectra7 to pursue other opportunities.


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