Tech-X Corp. will exhibit at EDI CON USA 2016 , taking place in Boston, Mass., September 20-22. Stop by Booth #123 to learn about Vsim finite difference time domain (FDTD) electromagnetic (EM) and particle-in-cell (PIC) simulation. Applications include magnetron sputtering, helix traveling wave tubes (TWTs) klystrons, gyrotrons, plasma physics and antennas.
With the latest release of ANSYS AIM, organizations can accelerate product design through upfront simulation, mitigate late-stage design changes, and reduce the number of costly physical prototypes. Now available, ANSYS AIM 17.2 enhances engineering simulation for thermal management, extends collaboration between designers and analysts, and brings upfront simulation to Japanese engineers in their own language.
Pickering Interfaces will showcase their broad range of PXI and LXI RF & Microwave switching solutions, along with their soon-to-be-released 2-slot USB/LXI Modular Chassis and LXI Simulation Tool at EDI CON USA 2016 in booth 822 on September 20-22, 2016.
Dassault Systèmes, the 3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions, announced it has entered into a definitive agreement to acquire CST - Computer Simulation Technology AG, the technology leader in electromagnetic (EM) and electronics simulation, for approximately 220 million euros.
COMSOL Inc. announced the latest release of the COMSOL Multiphysics® and COMSOL Server™ simulation software environment. Hundreds of user-driven features and enhancements to COMSOL Multiphysics®, COMSOL Server™ and add-on products have been implemented with an emphasis on accuracy, usability, and productivity.
A new and improved EM Socket II architecture within NI AWR Design Environment™ has been developed in order to enhance the AWR Connected™ for EM interoperability between third-party electromagnetic (EM) simulation tools and the company’s flagship high-frequency circuit design software, Microwave Office.