COMSOL, the leading provider of multiphysics modeling and simulation software, announced the release of the COMSOL Multiphysics® software version 5.1, the first and only integrated simulation environment for building multiphysics models and for creating and sharing easy-to-use simulation apps.
Mentor Graphics Corp. announced its newest version of the HyperLynx® Signal Integrity/Power Integrity (SI/PI) product for high-speed printed circuit board (PCB) designs. The HyperLynx product addresses high-speed systems design problems throughout the design flow—starting at the earliest architectural stages through post-layout verification.
CST – Computer Simulation Technology (CST) announces a new series of webinars showing the best way to get ahead with EM simulation. These webinars will cover both CST tools and products from CST’s partners Magus Pty. and Optenni Ltd.
Anritsu Co. announced it will feature a sophisticated, cloud-based connected car system for fleet tracking developed by the University of Hertfordshire in the UK using Anritsu network simulation technology in its stand (Hall 6/6F40) at Mobile World Congress 2015 (MWC), to be held March 2-5 in Barcelona.
Remcom announces PinBuilder™ electromagnetic model automation for XFdtd® EM Simulation Software. PinBuilder, which automates the creation of pin-field breakout models for XFdtd simulations, will be available in the software later this year.
Modelithics, Inc., in partnership with TriQuint Semiconductor, has released the latest update to the growing library of high-accuracy non-linear simulation models for TriQuint gallium nitride (GaN) transistors.
COMSOL Multiphysics users are already building applications and exploring the benefits of sharing their models with colleagues and customers worldwide. Arkansas Power Electronics Intl. (APEI) introduces the first multiphysics simulation app built with COMSOL's Application Builder.
Computer Simulation Technology AG (CST) presented new features for EDA simulation in CST STUDIO SUITE 2015 at Electronica 2014, including a new tetrahedral meshing algorithm and Pareto frontier optimization for decoupling capacitors.