The interface of the recently released Molex Inc. zCD™ active optical cable (AOC) interconnect solution has been selected by the industry leading CDFP MSA as the interface for the consortium’s 400 Gbps hot pluggable module. The zCD AOC assembly will be highlighted at Molex booth 3863, OFC 2014, March 11-13, San Francisco, CA.
Molex Inc. announced its NeoScaleTM High-Speed Mezzanine System at DesignCon 2014. Delivering remarkably clean signal integrity at data rates of 28+ Gbps, the modular mezzanine interconnect is designed for high-density printed circuit board (PCB) mezzanine applications with limited PCB real estate. Industry applications include enterprise networking towers, telecommunication hubs and servers, industrial controllers, and medical and military high data-rate scanning equipment.
Agilent Technologies Inc. announced a powerful new version of the Agilent EEsof EDA Advanced Design System software, ADS 2014. It is designed to dramatically improve design productivity and efficiency with new technologies.
UBM Tech, the daily source of essential business and technical information for decision makers in the electronics industry, has announced the Chiphead Theater program for DesignCon 2014, which will take place in Santa Clara, California on January 28 – 31, 2014.
AVX Corp. announces the availability of new Modelithics models for its 0402 tight tolerance, high current, and high Q multilayer organic (MLO) inductor series. The latest additions to AVX’s Modelithics Component Model Library are part-value sensitive, substrate scalable, and fully integrated with a range of software applications.
AVX Corp., a leading manufacturer of advanced passive components and interconnect solutions, is showcasing its full range of MLO™ diplexers at the European Microwave Week Exhibition. Based on its patented multilayer organic high density interconnect technology, AVX’s MLO diplexers employ high dielectric constant and low loss materials to realize high Q printed passive elements, such as inductors and capacitors in multilayer stack ups.
RFMW Ltd. announces immediate availability for Carlisle Interconnect Technologies WMP series of sub-miniature, blind-mate interconnect solutions. The WMP series is ideal for complex, high performance microwave modules and systems where the use of a light weight connector is a primary issue. The WMP series feature set makes them a perfect solution in military radios, radars, space, and test applications.