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Industry News

Rogers’ New RO4360™ Laminates and RO4460™ Prepreg for Multilayer Power Amplifier Designs

August 7, 2010
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Rogers Corp. recently introduced two new products: RO4360™ laminates and RO4460™ prepreg, developed for use in compact, multilayer power amplifier designs. These new materials feature a matched dielectric constant (εr) of 6.15 and dielectric loss (Df) of approximately 0.003 at 2.5 GHz. Building on the successful legacy of the companyís RO4000® series materials, RO4360 laminates and RO4460 prepreg allow designers to reduce the overall size of their circuit boards (typically estimated between 20 and 30 percent) and save valuable real estate on passive board features.

RO4360 laminates and RO4460 prepreg provide the performance and reliability designers need in a lower total PCB cost solution. The materials are based on a ceramic-filled, thermoset resin system reinforced by glass fiber for excellent mechanical stability. The new products feature a low dissipation factor and generous power-handling capability; the thermal conductivity of the RO4360 laminate is 0.8 W/m-K. The matched-dielectric constant prepreg allows low-cost, homogenous, multilayer designs that were previously challenging due to the limits of competitive PTFE material options. RO4360 laminates may also be used with epoxy-based materials in hybrid designs.

The environmentally friendly RO4360 and RO4460 materials are RoHS compliant and compatible with standard PCB processing methods. The materials exhibit a high glass transition temperature (Tg) of greater than 280°C and a low coefficient of thermal expansion (CTE) in the z-axis, necessary for reliable plated through holes (PTH) in multilayer circuits. Drilling and plating of vias are less costly than PTFE-based materials and do not require time-consuming and expensive plasma hole-wall preparation processes.

When size and cost reduction are critical to a design, RO4360 laminates and RO4460 prepreg materials with their 6.15 dielectric constant represent a technological breakthrough. As the first high Dk, RF grade thermoset resin system available, they are an optimal choice for engineers working on designs including power amplifiers, patch antennas and other commercial high-frequency applications.

Rogers Corp.,
Advanced Circuit
Materials Division
(480) 961-1382,
RS No. 300

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