M/A-COM Technology Solutions Inc., a supplier of semiconductors, components and subassemblies for use in RF, microwave and millimeter-wave applications, and Mimix Broadband Inc. jointly announced that their respective corporate parents have signed a definitive merger agreement that will add Mimix and its subsidiaries to the M/A-COM Tech family of companies. Mimix is a fabless supplier of high performance gallium arsenide (GaAs) semiconductors from DC to 50 GHz for RF, microwave and millimeter-wave applications. Pursuant to the merger agreement, Mimix Holdings Inc. and its subsidiaries will join M/A-COM Tech as subsidiaries of M/A-COM Technology Solutions Holdings Inc. Financial terms were not disclosed.
Rosenberger Hochfrequenztechnik GmbH & Co. KG, Tittmoning, Germany, has acquired CDS DataComm of Plano, TX. The newly acquired company will be called Rosenberger CDS LLC and will continue to operate with its current management and staff in its Plano, TX facility. Details of the transaction were not disclosed.
CPI International Inc. announced the signing of a definitive merger agreement with Comtech Telecommunications Corp. (CMTL) under which Comtech will purchase CPI in a cash and stock transaction with an enterprise value of approximately $472.3 M. Comtech will fund the acquisition by redeploying approximately $372.0 M of its existing cash plus the issuance of approximately 4.4 million shares of Comtech common stock. All existing CPI debt is anticipated to be repaid upon the closing of the transaction.
Linx Technologies Inc., a provider of easily applied, cost-effective wireless solutions, announced its acquisition of Apex Wireless Inc. in a transaction with undisclosed terms. Based in Boulder, CO, Apex Wireless has provided RF product development, contract design and wireless consulting services since 1985. Apex specializes in high performance, cost-optimized wireless products employing RF transmitters, receivers and transceivers, including frequency hopping and direct sequence radios.
Wireless Telecom Group Inc. announced the completion of its previously disclosed agreement to sell substantially all of the operating assets of its wholly owned subsidiary Willtek Communications GmbH and affiliates to Aeroflex Inc., a Delaware corporation, in exchange for $2,750,000 in cash and the assumption of certain liabilities. The cash purchase price is subject to a post-closing adjustment if the adjusted net assets sold at the date of closing are less than the adjusted net assets target set forth in the purchase agreement. As part of the sale, all current employees of Willtek Communications GmbH and its affiliates will be offered employment with affiliates of Aeroflex.
Murata Manufacturing Co. Ltd. announced the restructuring of its wireless module business in North America, establishing Murata Wireless Solutions. This action aligns the resources of SyChip Inc. with those of Murata Electronics North America Inc.'s existing Wireless Business Development Group, thus significantly extending the company's customer support and design services. John F. Denslinger will head the new organization and serve as Senior Vice President, Murata Wireless Solutions and President of SyChip Inc.
Valpey Fisher Corp., a leader in low noise timing solutions, announced the creation of its Microwaves Products Group. The group will focus on the design, manufacture and marketing of high performance RF/microwave components and integrated modules for a broad range of end markets, including microwave point to point, wireless infrastructure and military communications.
RF Micro Devices Inc. (RFMD) announced the company has added high power Integrated Passive Component (IPC) technology to RFMD's foundry services portfolio and began providing IPC technology to customers of its Foundry Services business unit in June of this year. RFMD's IPC technology is complementary to its GaN technology, and other power semiconductor technologies, for the design of multi-chip modules (MCM). With RFMD's IPC technology, foundry services customers can design integrated matching networks and other passive functions on RFMD's gallium arsenide (GaAs) process technology. This allows RFMD's foundry services customers to reduce costs and achieve higher levels of integration by leveraging RFMD's industry-leading scale and cost structure in GaAs and GaN manufacturing.
The Wi-Fi Alliance and the Wireless Gigabit Alliance (WiGig Alliance) announced a cooperation agreement for multi-gigabit wireless networking. The Wi-Fi Alliance and the WiGig Alliance will share technology specifications for the development of a next-generation Wi-Fi Alliance certification program supporting Wi-Fi® operation in the 60 GHz frequency band. This agreement further encourages the development of products supporting 60 GHz technology to expand existing Wi-Fi capabilities.
Agilent Technologies Inc. and Tabor Electronics Ltd. announced an OEM agreement establishing Tabor as a provider of Agilent test solutions for the high-speed arbitrary waveform generator (AWG) market. An integral aspect of this OEM agreement is the all-new Agilent 81180A, a 4.2 GSa/s arbitrary waveform generator that delivers exceptionally high dynamic range.
Carlisle Interconnect Technologies, Jerrik Division, announced its US Patent 7,672,140, CIRCUIT BOARD CONFIGURATION, issued March 2, 2010. Using an innovative new design, CarlisleIT Jerrik has developed a printed circuit board (PCB) for transient voltage suppression (TVS) filter connectors that incorporate the TVS diodes directly into the PCB. Previously the TVS diodes were clustered around the PCB in a 'cordwood' type arrangement. This new development in PCB design creates a TVS filter that is more compact, lighter in weight, costs less and is quicker to manufacture. Now military and aerospace avionics suppliers can design electromagnetic pulse and lightning protection into their modern equipment while using less space and weight than a conventional filter connector. This patented design for diode packaging can be used in several applications including military aircraft, commercial aircraft and helicopter environments.
EM Research Inc., a designer and manufacturer of miniature frequency synthesizers, phase-locked oscillators and signal sources for commercial, military and government systems, announced that it has achieved ISO 9001:2008 certification. EM Research has been awarded this designation by Orion Registrar Inc., for meeting the guidelines set out by the International Organization for Standardization.
Superior Technical Ceramics Corp. announced it has been awarded certification to AS9100, the International Aviation, Space & Defense Organizations Quality Standard by AQA. As such, Superior Technical Ceramics Corp. has simultaneously been certified by AQA to ISO9001. STC is an American owned manufacturer of custom technical ceramics for over 100 years.
TriQuint Semiconductor announced that it has been awarded a contract by the US Air Force Research Laboratories (AFRL) to develop new Gallium Nitride (GaN) modules for unmanned aerial vehicles (UAV). TriQuint's new GaN devices will extend the range and capabilities of UAVs that are used for reconnaissance missions over Afghanistan, Iraq and other regions.
Skyworks Solutions Inc., an innovator of high reliability analog and mixed signal semiconductors enabling a broad range of end markets, announced that it has captured design wins at MediaTek in support of several of its next-generation platforms targeting low-cost handsets in emerging markets.
Auriga Microwave announced it received its fifth Phase II Small Business Innovative Research (SBIR) award. Auriga will begin a two-year contract with the Navy's Naval Sea Systems Command (NAVSEA) to build a high-efficiency, solid-state radar power amplifier under SBIR N08-172. This award brings Auriga to a total of five Phase II SBIR awards granted to the company since early 2009.
In addition to the successful development in the Laser Direct Structuring (LDS) business, LPKF is about to achieve another breakthrough within the cutting and structuring laser segment. The company has received a major order for laser systems used for the depaneling of assembled PCBs. The order volume is just under €6 M ($7.3 M) and is anticipated to be completed within the current financial year. The newly developed LPKF MicroLine laser systems will finally make the depaneling with lasers within mass production competitive and deliver, at the same time, unmatched accuracy.
New Market Entries
TotalTemp Technologies Inc. is a manufacturer of temperature cycling and conditioning equipment. TotalTemp's primary expertise is based on creating thermally conductive environments to transfer heat to and from the Device Under Test (DUT). The most widely known product for this purpose is a thermal platform, often referred to as a "hot/cold plate". Thermal Platforms have a flat anodized aluminum surface that use thermal conduction to transfer heat to and from the DUT. Any product that requires temperature testing and has a reasonably low profile and a flat thermally conductive surface can be conditioned on a thermal platform. Two engineers with almost 40 years combined experience in this field formed TotalTemp Technologies to provide customers with a new and more affordable alternative to the standard thermal platform systems currently on the market. The real benefit of this improved simplified solution is that the TotalTemp's Next Generation product line is safer, extremely reliable and much more cost effective. For more information, visit www.totaltemptech.com.
Freescale Semiconductor entered the gallium arsenide (GaAs) Monolithic Microwave Integrated Circuit (MMIC) marketplace with the introduction of four new devices designed and optimized specifically for high performance in macro base stations, repeaters and femtocells employed in wireless networks. The devices address low-noise amplifiers and transmit power amplifiers, two elements of wireless infrastructure equipment for which extremely high RF performance is critical. The devices are also designed for low power consumption, resulting in optimized energy efficiency and long-term reliability.
BC Systems announced the appointment of Joseph Seminoro as Manager of Business Development. In his new position, Seminoro will be responsible for expanding the company's sales within the aerospace and defense industry throughout North America. Seminoro has more than 22 years of experience in the RF and microwave industry. He comes to BC Systems from Microphase Corp. where he was Manager of Business Development. He was previously a Regional Sales Manager at RLC Electronics, National Sales Manager at Polyflon Co., and earlier held management and engineering positions in the electronic industry.
Thunderline-Z, a supplier of feedthrus and hi-rel packages to the RF/microwave community, has recently announced the appointment of Timothy Lacey to the position of National Sales Manager, effective immediately. Lacey most recently worked in the Emerson Climate Technologies Division in Sidney, OH, as a Strategic Commodity Manager, and has moved to Thunderline-Z where he will manage sales territories across the country. He obtained his Bachelor of Science Degree in Electrical Engineering from Ohio University and continued his education at the University of Pittsburgh where he obtained his Masters of Business Administration from the Katz Graduate School of Business.
International representation for Endwave in India will be covered by Hicotronics Devices, specifically by its military and space department. Hicotronics Devices will increase Endwave's international presence in India, and can be contacted by phone or e-mail (91-80-22420690/41203768, firstname.lastname@example.org). Alignment Co. will do likewise for Endwave in China, as they are experienced professionals in the China IC market and understand the product technology, customer demands, channel management, and local business systems and methods. Located in Shenzhen, China, Alignment will cover all of China and can be reached by phone or e-mail (+86-755-82537066, email@example.com, www.alignment-china.com). Tel Aviv-based NextWave Technologies will represent Endwave in Israel in its commitment to high-level engineering, sales and marketing to support both customers and manufacturers business models. NextWave can be contacted by phone or e-mail as well (972-3-9619000, firstname.lastname@example.org).
RFCONNEXT Inc.'s new web page provides extensive information about the new high speed interconnect technologies PMTL™, VMTL™ and SMTL™, which together provide increased bandwidth for any high speed interconnects, thus help advancing the High Speed Interconnect Ecosystem. In addition to information, the web page provides a large number of white papers and information that will be of great interest to RF/microwave engineers as well as the high speed digital community. Additionally, the web page provides various examples of bandwidth enhancements in cables and connectors, high speed backplane, high speed and mmw packaging, test and measurement, and RF/microwave circuits and systems. For more information, visit www.rfconnext.com.