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Industry News

Avago Develops RF Front-end Solution for Point-to-point Radio Markets

May 25, 2010
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Avago Technologies, a supplier of analog interface components for communications, industrial and consumer applications, announced early prototypes have been manufactured of Avago’s proprietary five-chip family that targets the expanding 38 and 42 GHz cellular radio infrastructure and backhaul point-to-point radio markets. Based on market demand and customer feedback, Avago designed the millimeter-wave products for high performance in Surface Mount Technology (SMT) packages.

“Our 38 GHz and 42 GHz point-to-point radio solution has four primary chips and a wafer level packaged directional power detector,” said Allen Chien, Multimarket Marketing Manager of Avago Technologies. “Our innovative chipset will help cellular operators increase their backhaul capacity to meet the demands of mobile data users.”

The wireless infrastructure market is expanding to meet the increasing data rate and reliable connection demands of cellular customers. Smart phones and other devices require high bandwidth data that must be provided by backhaul solutions. Point-to-point backbone radios carry the high capacity traffic from fiber Points-of-Presence (POPs) to wireless access points.

In areas of the world, 38 GHz (37 to 40 GHz) and 42 GHz (40.5 to 43.5 GHz) are licensed wireless infrastructure bands. As new point-to-point radios are designed and installed to increase capacity, many radio manufactures are switching to SMT packages and away from traditional chip-and-wire devices. With SMT technology, radio suppliers can offer lower cost, more compact radios to the market and with shorter design cycles.

The chipset is fabricated using Avago’s proprietary 0.17 µm gate Pseudomorphic High Electron Mobility Transistor (PHEMT) process. With 80 GHz FT transistors, this process is more than capable of meeting 40 GHz applications needs. Manufactured in Avago’s high yield, high volume, 6-inch wafer processing facility the chips are packaged in 5 x 5 mm SMT packages with shipment to be in tape and reel. The manufacturing and test operation is fully automated and capable of supplying millions of chipsets per month.


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