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IEEE MTT-S IMS 2010
May 23-28, Anaheim, California
Ready for Anaheim?
1999 was the last time the International Microwave Symposium was held at the Anaheim Convention Center. The Symposium theme, “The Magic Touch of Microwaves,” was a play off the proximity to Disney’s Magic Kingdom. However, General Chair Bob Eisenhart, writing in the Microwave Journal show issue from that year, preferred to explain the theme in terms of the “magic” that microwave engineers perform. Eisenhart invited attendees to “get together and open your personal 'bag of tricks' to see what all of the presenters and exhibitors have to share.” If Microwave Week is a time to “show the magic,” then not much has changed in 11 years.
Delivering the industry-leading portfolio of high-performance RF components for Point-to-Point Microwave Radio, WiFi, WiMAX, SmartEnergy AMI, ZigBee®, Wireless Infrastructure, Military and Space, Broadband and Data Transmission and General Purpose RF Applications.
Visit RFMD® Booth 810 and pick up a copy of our new Product Selection Guide, featuring 150 new products.
Click here to learn more.
MTT-S Product Showcase: Crystek Corp.
Crystek has introduced a new line of low-loss RF coaxial cable assemblies featuring rugged stainless-steel solder-clamp construction and attenuation of 0.36 dB/ft. at 18 GHz. The LL142 Series cable offers shielding effectiveness of greater than -110 dB with an operating temperature range of -55° to +85°C.
See us in MTT-S Booth 3231
Visit MTT-S Product Showcase's Vendor View -->
Mini-Circuits: Wideband Microwave Amplifier AVA-24+
The Mini-Circuits AVA-24+ is a surface-mount, microwave amplifier and fully integrated gain block up to 20 GHz. It is packaged in Mini-Circuits’ industry standard 3×3 mm MCLP (QFN) package, which provides excellent RF and thermal performance. The AVA-24+ integrates the entire matching network with the majority of the bias circuit inside the package, reducing the need for complicated external circuits.
See us in MTT-S Booth 531
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RFMD®: RF5755 Front End Module
RFMD's RF5755 front end module delivers a complete integrated solution for handset/handheld WLAN 802.11b/g/n and Bluetooth® systems. Integrating a 2.5 GHz power amplifier, SP3T switch, low noise amplifier, SPST switch, and power detector coupler, the module also features integrated matching circuitry with output harmonic attenuation, reducing BOM and manufacturing costs.
See us in MTT-S Booth 810
Visit RFMD's Vendor View -->
Rogers Corp., Advanced Circuit Materials: RO4360 High Frequency Laminates
RO4360 thermoset laminate materials are specially formulated to meet a Dk of 6.15 and exhibit a low dissipation factor of 0.0038 at 10 GHz. RO4360 laminates possess a Z-axis coefficient of thermal expansion of 30 ppm/°C (CTE) for dependable plated-through-hole (PTH) quality in multilayer circuit and package designs and are lead free process capable.
See us in MTT-S Booth 2920
Visit Rogers Corp., Advanced Circuit Materials' Vendor View -->
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2010 RFIC Symposium: RF Design for New Horizons
Yann Deval, 2010 RFIC General Chair
Introduction to the 2010 IEEE Radio Frequency Integrated Circuits Symposium, to be held in Anaheim, Sunday, May 23rd to Tuesday, May 25th
Over 100 IMS exhibitor’s participated in our annual show issue Exhibitor Profile feature this year. From Advanced Control Components Inc. to Z-Communications Inc. our A to Z look at the companies and products that will be at this year's IMS is a good source of pre-event information.
The Anaheim Connector
Use Microwave Journal's Twitter feed to determine what to see and where to eat while in Anaheim
Call to Action: IMS 2010 Registration
Early bird registration for IMS2010 extends through May 7, and advance registration is available from May 8 to May 21. In addition to IMS 2010, Microwave Week includes the collocated RFIC Symposium and the ARFTG Conference. A SuperPass option gives attendees access to all that Microwave Week has to offer with a 15 percent discount.
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