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Industry News / Subsystems and Systems

Lime Microsystems and AirWalk Femtocell Collaborate

March 29, 2010
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AirWalk Communications and Lime Microsystems have cooperated on the development of a high-performance, low-cost radio solution for AirWalk's EdgePoint™ PRO enterprise femtocell. Lime Microsystems' configurable broadband transceiver, the LMS6002, is a powerful integrated single chip transceiver system that provides flexibility when applied to the design of femtocell radio subsystems. Support for operation over multiple frequency bands enables the development of dual-band femtocells with frequency-agile pilot beacons while reducing band-specific parts count.

The inherent efficiencies provided by the LMS6002 transceiver allow AirWalk to bring the EdgePoint PRO to market in a shorter timeframe with reduced size, lower power consumption and a smaller footprint compared with conventional transceiver implementations.

By supporting multiple air interface standards, the LMS6002 is also ready to support new configurations, including femtocells incorporating LTE technology. Advanced digital interfaces allow continuous control over transceiver operation while providing security against unauthorized operation, a particular concern for femtocell operators.

"We see this collaboration with Lime Microsystems as a key enabler for the EdgePoint PRO, providing the wideband capabilities to allow us to build femtocells in various RF bands at minimal cost while having the flexibility to address the market needs of worldwide operators," said Serge Pequeux, President and CEO of AirWalk Communications. "The LMS6002 also allows us to develop radios that not only meet, but exceed, 3GPP2 specifications, making the EdgePoint PRO a highly efficient, reliable, and low-cost solution for enterprise wireless needs."

Ebrahim Bushehri, CEO of Lime Microsystems, added, "Cost and performance are critical in allowing femtocells to live up to their market potential. The LMS6002 transceiver helps meet AirWalk's objective of cost reduction by increasing the level of integration and reducing component count, while maintaining high performance and design flexibility."


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