LPKF Laser & Electronics AG, which manufactures machines and laser systems used in electronics fabrication, medical technology and the automotive sector, has announced that it will double the production capacity for cutting and structuring lasers at its facility in Garbsen, Germany by the end of the first quarter of 2010 and boost capacity even further in the second quarter.
The main reason for this increase in production is to satisfy the continuing demand for laser systems for electronics production in Asia. Laser Direct Structuring (LDS) technology in particular, which is currently used mainly for the production of cellphone antennae, has filled the company’s order books since the beginning of 2009.
“We have strengthened the personnel capacities in the Cutting and Structuring Lasers segment, by internal restructuring and targeted recruitment. The next few years will also see an expansion of our headquarters in Garbsen. These measures are all in response to the increasing demand for our laser systems,” said CEO Ingo Bretthauer.