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RFaxis Rocks Wireless Markets with Pure CMOS RF Front-end Platform
RFaxis, a fabless semiconductor company focused on innovative, next-generation RF solutions for the wireless and connectivity markets, unveiled its next-generation pure CMOS RF Front-end Integrated Circuits (RFeIC) platform to complement its current BiCMOS RFeIC platform used to enable its portfolio of fully integrated, single-chip, single-die RF front-end solutions.
If the "Holy Grail" of integration for wireless connectivity is to deliver a complete wireless radio on a single CMOS silicon die, RFaxis' new pure CMOS RFeIC platform enables a game-changing leap towards this goal.
"We leveraged our BiCMOS experience to accelerate the completion of our pure CMOS RFeIC platform to provide our customers and investors a revolutionary sequel to our current portfolio of best-cost/best-quality RF front-end solutions, and to transform the RF front-end game once and for all," said Mike Neshat, President and CEO of RFaxis.
Dr. Oleksandr Gorbachov, CTO of RFaxis, goes on to explain, "Our RFeIC platforms are essentially RF architectural templates that allow us to quickly spin-up new RF front-end solutions for compelling market opportunities for battery-operated wireless devices and for wireless devices with a continuous power supply. We are very excited about our pure CMOS RF front-end platform because it is a testimony that RFaxis is a true innovation leader."
Dr. Ping Peng, COO of RFaxis, adds, "Furthermore, our new pure CMOS platform is simply elegant, in that our new platform is architected for standard and proven 0.18 and 0.25 micron CMOS processes, and for abundant and inexpensive CMOS silicon material. This means our next-generation RFeICs based on this platform can be reliably and cost-effectively manufactured by a wide variety of major foundries globally."
The RFaxis BiCMOS RFeIC product lines available for delivery in early 2010 will be unveiled in time for the 2010 Consumer Electronics Show in January. More information regarding the RFaxis CMOS RFeIC product roadmap and delivery timetable is forthcoming.