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RFaxis, a fabless semiconductor company focused on innovative, next-generation RF solutions for the wireless and connectivity markets, announced that it has selected IBM Microelectronics to manufacture its fully integrated, single-chip, single-die RF Front-end Integrated Circuits (RFeIC). The RFeICs will be manufactured using IBM Microelectronics' BiCMOS process technology, at its semiconductor facility in Burlington, VT.
"We are pleased RFaxis has chosen IBM's BiCMOS process technology to manufacture its innovative RFeICs," said Jim Rogers, Manager of IBM Microelectronics' analog/mixed-signal foundry business. "Our latest BiCMOS technology represents a culmination of innovation in silicon process engineering, allowing levels of integration in front-end IC technology unmatched by traditional technologies. IBM is looking forward to working with RFaxis to manufacture and supply these revolutionary RFeICs."
RFaxis' patent pending RFeICs integrate the power amplifier, low-noise amplifier, transmit and receive switching circuitry, the associated matching network, and the harmonic filter all in a single-chip, single-die device. These RFeICs combine superior performance, high sensitivity and efficiency, low noise, small form factor, and low cost to form an ideal solution for applications requiring low power, extended range and bandwidth and small form factor.
"IBM's expertise in manufacturing and supply chain management coupled with their superior technical merits make them a perfect fit for RFaxis, and we are confident that the addition of their process development and foundry services will help RFaxis meet and exceed the expectations of our customers worldwide," noted Mike Neshat, President and CEO of RFaxis. "By partnering with IBM, RFaxis can confidently engage with ODMs and OEMs that have high volume application demands, as they can be reassured that their needs will be met."
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