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Accel-RF announces a significant addition to its family of proven RF Reliability Test System Products. The new High Power RF (HiPR-AARTS) Automated Accelerated Reliability Test System will help manufacturers prove reliability for application specific devices.
Manufacturers are using Accel-RF’s equipment to prove intrinsic reliability and performance degradation characteristics of GaN technology on discrete devices and lower power MMICs. The next stage in the development of the technology is to build and test high power devices for use in radar and military and communication electronics.
“As reliability is proven on lower powered devices, the technology evolution is moving toward high power GaN, MMICs, HEMT and HFET devices that require significant advancements in reliability testing equipment,” says Roland Shaw, President and Founder of Accel-RF. The new system is either liquid or air cooled, has RF and DC pulsing capability, and can handle device power dissipation of up to 200 W each. “This new system can manage over seven times more power than our current generation product,” continues Shaw. “This capability allows our customers to lifetest their products at channel temperatures in excess of 300°, with performance characterization at normal operating temperature levels.” All in-situ in the HiPR-AARTS.
“In addition to our customers, compound semiconductor manufacturers, specifically Wide Band-Gap initiative partners and Tri-Services component teams are currently pushing the capabilities of our existing products,” says Shaw. “Our new High Power RF Reliability Test System will give our customers plenty of capability to prove reliability of new technology in real-life conditions now and into the future, and Accel-RF is ready to supply this leading-edge equipment worldwide.”
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