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Rogers Corp., a supplier of high frequency laminates will be promoting recently introduced products at the European Microwave Exhibition, booth # 514, September 29 – October 1.
RT/duroid® 5880LZ materials have the lowest Dk for a copper clad laminate available in the market today. Because of its low dielectric constant of 1.96 at 10 GHz, RT/duroid 5880LZ supports broadband applications at the microwave through millimeter-wave frequencies where dispersion and circuit losses must be minimized. It is a lightweight, PTFE-based composite optimized with a unique filler that provides low density (1.37 gm/cm3) and a low coefficient of thermal expansion (CTE) in the Z-axis. This makes 5880LZ well suited for fabricating high-frequency circuits with plated-through holes (PTH) and allows higher vehicle payloads. In addition, the dielectric constant is uniform from panel-to-panel and constant over a wide frequency range, with a low Z-axis TCDk of +22 ppm/°C. Its low dissipation factor extends the usefulness of RT/duroid 5880LZ to Ku-band and above.
Rogers’ 5880LZ laminate materials are made using the same high quality, reliable materials and processes that Rogers pioneered and that enable Rogers to win top awards from the largest manufacturers and fabricators of high frequency materials in the world.
Rogers will also provide many other examples of its innovative printed-circuit laminate materials, including its low-cost RO4730™ LoPro™ antenna-grade laminates. Benefits of this laminate include a dielectric constant of 3.0, compatibility with conventional FR-4 and high-temperature lead-free solder processing, and a lightweight composition (30 percent lighter than glass-filled PTFE laminates). In addition, visitors can learn about Rogers RO3730™ ceramic-filled laminates. These high-performance laminates are engineered for antenna designers as a cost-effective PTFE-based laminate alternative. The RO3730 materials are reinforced by woven glass for excellent electrical performance and outstanding structural stability, with low Z-axis coefficient of thermal expansion (CTE) for repeatable plated-through-hole (PTH) fabrication. The RO3730 laminates feature low passive intermodulation (PIM) performance and a dielectric constant of 3.0, making them ideal for use in 3G and 4G cellular base stations.
The LoPro technology utilized by RO4730 laminates is also available across the standard RO4000® product line. LoPro laminates use a proprietary Rogers’ technology that allows reverse-treated low profile copper foil to achieve good bond to standard RO4000 dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4000 laminate system.
RT/duroid 6202PR materials are used in designing complex microwave structures such as antennas and multilayer circuits with interlayer connections. RT/duroid 6202PR offers the same electrical and mechanical properties as RT/duroid 6202, in addition to enabling tight tolerance planar resistors (PR) when clad with resistive copper foils. Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement.
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