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Industry News

Hirai SK Features Multi-layered LTCC Substrates

September 23, 2009
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Hirai SK Corp. provides its featured foundry service of multi-layered LTCC substrates made by its cost-competitive process. Hirai targets higher Q, dimensional precision and the high yield for RF and mm-wave applications. Displayed in the exhibition are miniaturized BPF with low loss, mm-wave antenna integrated LTCC transceiver module, tapered LTCC substrate and hermetically-sealed LTCC package for micro- and mm-wave applications. Hirai ships samples in a week after the design freeze and provides RF test and design services. The design kit CD is also available.

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