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UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, has announced the release of the new UltraVia™. This addition to the company's UltraTechnologies product line, which consists of the UltraCapacitor™, the UltraBridge™, and the UltraInductor™, is the next generation of integrated thin film via connection technology. The UltraVia uses a unique process and provides void-free construction featuring a high quality bond of the gold plug material to the ceramic sidewall. The pure gold construction of the UltraVia allows for maximum thermal conductivity and superior electrical performance.
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