- Buyers Guide
Aerospace & Defense Electronics Supplement
Early Returns: U.S. Export Control Reform Positive
A&D Test & Measurement
Efficient Design and Analysis of Airborne Radomes
UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, has announced the release of the new UltraVia™. This addition to the company's UltraTechnologies product line, which consists of the UltraCapacitor™, the UltraBridge™, and the UltraInductor™, is the next generation of integrated thin film via connection technology. The UltraVia uses a unique process and provides void-free construction featuring a high quality bond of the gold plug material to the ceramic sidewall. The pure gold construction of the UltraVia allows for maximum thermal conductivity and superior electrical performance.
Get access to premium content and e-newsletters by registering on the web site. You can also subscribe to Microwave Journal magazine.