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Industry News / Materials/Packages

Rogers to Showcase High Frequency Laminates

March 25, 2009
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Rogers Corp., a supplier of high frequency laminates for circuit boards in amplifiers, microwave radios, base station antennas, routers and switches, will feature a variety of its high performance materials at CTIA 2009, in Las Vegas, NV, April 1st through 3rd (Booth# 1074).

Rogers Corp., participating for the first time at this major cellular communications tradeshow, will be part of the RF Zone, an area of the show devoted to companies with various RF solutions. Visitors to the Rogers' display at Booth 1074 can discuss their design challenges with Rogers’ applications engineers, and learn more about Rogers' state-of-the-art circuit-board materials. Among Rogers’ materials at the CTIA 2009 will be:

RO3000® Laminates: These high frequency laminates exhibit extremely low dielectric losses for demanding high frequency applications. They boast excellent mechanical stability as well as stable dielectric constant characteristics with frequency and temperature for high reliability.

RO4000® Laminates: Offering outstanding value for high frequency applications, these laminates deliver uniform dielectric constant across each sheet, with low dissipation losses, low coefficient of thermal expansion (CTE) and excellent dimensional stability.

ULTRALAM® 3000 Materials: Well suited for high frequency packaging and circuits, these materials minimize dielectric losses and maintain tight control of dielectric constant across a circuit board.


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