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Infineon and Huawei Sign Communication ICs Agreement
Despite the global financial recession, China demonstrated its support for European enterprises with its strong purchasing power, during late February when a business delegation of about 200 Chinese entrepreneurs, led by Commerce Minister Chen Deming, made a procurement tour to Germany, Switzerland, Spain and the UK. One of the major deals signed on the tour saw Huawei Technologies agree to purchase semiconductor solutions from Infineon worth $68 M in 2009.
This deal is intended to supply end-to-end chip solutions to Huawei’s wireline and wireless communication systems, with Infineon providing semiconductor solutions in the area of Mobile Phone Platforms, Central Office solutions and Customer Premise Equipment. These products and technologies will enable Huawei to deliver advanced and sophisticated systems to the telecom markets and shipment of the first products has already begun.
“We feel very much honored to sign this agreement with Huawei,” said Dominik Bilo, senior vice president, sales, marketing and distribution of Infineon Technologies. “Huawei and Infineon are maintaining a very positive and long lasting business relationship. We are very happy that we could extend this successful relationship from year to year and now sign this agreement for delivering cutting-edge technologies and communication solutions.”