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Industry News / Materials/Packages

Rogers to Feature Advanced Circuit Materials

February 24, 2009
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Rogers Corp.'s Advanced Circuit Materials Division (ACMD) will be exhibiting RO4000®, RO2808™ and ULTRALAM® 3000 advanced high performance laminates at the upcoming IMAPS Device Packaging show to be held at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, AZ on March 10th and 11th (Rogers booth #12).

RO4000, RO2808 and ULTRALAM 3000 laminates provide proven solutions for a wide range of applications such as high performance chip carrier substrate, high speed network transport gear and high speed data transmission used in high speed computing, telecommunications and wireless.

Design engineers will be particularly interested in the recently launched RO2808 high frequency material. A ceramic-filled PTFE material with a dielectric constant of 7.6, RO2808 material offers the stability and high frequency performance of LTCC. RO2808 material boasts a low loss tangent of 0.002 or less, and can be supplied as 1-mil thick boards to support low profile designs. It also features high moisture resistance, high reliability and excellent high frequency performance.

RO4000 laminate is widely used in the power amplifier market, with outstanding electrical and mechanical properties. A low loss material, RO4000 laminate exhibits low z-axis expansion, making it an ideal choice for high frequency applications in which plated through-hole reliability is important.

Rogers' ULTRALAM 3000 Series LCP circuit material is a thin double-clad copper laminate, characterized by low and stable dielectric constant (2.9) and dielectric loss. It has very low moisture absorption (< 0.04 percent by weight). ULTRALAM 3000 Series laminates are used for high frequency microminiaturization applications, sensors, antennas and high-speed flip-chip designs. ULTRALAM 3000 can be used with ULTRALAM 3908 bonding film for multilayer constructions.


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