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Industry News

The Dawn of Nano-scale System-on-Package

February 1, 2009
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Much of today’s R&D in high-frequency electronics is concerned with squeezing more functionality into a smaller package at an affordable price. While large, complex ICs known as System-on-Chip (SoC) are the choice when production volume is high, multi-chip integration often wins for lower volume and speedier time-to-market. The multi-chip...
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