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Industry News / Manufacturing/Services / Materials/Packages / Semiconductors / Integrated Circuits / Test and Measurement

Hesse & Knipps Partners with MEW Consulting

January 7, 2009
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Hesse & Knipps, a manufacturer of high-speed, fine pitch wedge bonders for the back-end semiconductor industry, will partner with MEW Consulting, recently founded by Michael Whitehead, to provide technical support for third-party wedge and wire bonding equipment being phased out by the original manufacturers. Through the partnership, Hesse & Knipps and MEW Consulting will provide various support services including:

• High level technical and process/applications support
• Wire/wedge bonding equipment repairs
• Automatic wedge bonder rentals that protect against extended machine down-time situations
• Training programs
• Maintenance programs

As a value-added service to customers, Hesse & Knipps will accept legacy equipment as trade-ins for new Hesse & Knipps bonding equipment purchases. Additionally, Hesse & Knipps will offer leasing packages that can protect a customer against losses due to extended machine down situations. For a list of wedge and wire bonding equipment supported through the partnership or for more information, contact Michael Whitehead at (214) 358-6557.

“In addition to legacy wedge bonding equipment, we have made a commitment to support legacy die bonding equipment through a recent partnership formed with CMTec AG," notes Joseph Bubel, president, Hesse & Knipps. “It is our firm belief that strong technical support capabilities, complemented by our technological leadership in areas such as Process Integrated Quality Control, will be key in supporting the current and future requirements of our customers and the market. We also remain committed to the design and development of new semiconductor technology to support the future needs of our customers and the market.”


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