- Buyers Guide
SiGe Semiconductor Inc. announced an RF front-end solution for Wi-Fi® applications. The device is based on an innovative architecture that is the first to integrate two fully matched power amplifiers on a single die. The architecture optimizes size and power consumption, enabling manufacturers to support wireless multimedia applications in computing and embedded systems while meeting the ever-increasing consumer requirements for miniaturization, battery life and low cost.
The SE2566U is the industry’s only RF front-end solution to integrate two 2.4 GHz fully matched power amplifiers on a single die. The device also integrates harmonic filters, input and output matching circuitry, and power detectors for each transmit stream in a small 3 x 3 mm package. Moreover, the high level of integration reduces external bill of materials by 80 percent when compared with two unmatched PAs for MIMO solutions, resulting in a bill of materials savings of approximately 25 cents.
“The entry level computing market, encompassing desktop replacements for business and students, is the largest and fastest growing segment of the computing market. With the SE2566U, we have delivered a solution that is unmatched on the market when it comes to maximizing feature integration while meeting the increasing demands for small size, extended battery life and price competitiveness of this segment,” said Jose Harrison, director, product marketing, computing and consumer, SiGe Semiconductor.
Get access to premium content and e-newsletters by registering on the web site. You can also subscribe to Microwave Journal magazine.