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Military Microwaves Supplement
Laird Technologies Inc., a leader in the design and manufacture of customized, performance-critical components and systems for wireless and other advanced electronics, announced a new range of proprietary RF modules, providing a new standard of performance for 2.4 GHz radios.
Laird Technologies’ LT2510 is a fifth generation 2.4 GHz FHSS module that sets the standard for industrial RF communication. Based on its established proprietary FlexRF™ technology and operating in the globally available 2.4 GHz spectrum, the LT2510 is optimized to outperform conventional wireless standards.
“Wireless standards always involve a degree of compromise in that they have difficulty meeting extreme levels of performance requirements,” said Nick Hunn, Advanced Technology Director of Laird Technologies. “The LT2510 is optimized to deliver outstanding performance in terms of range or power consumption, taking it beyond the bounds of the standards-based offerings, while maintaining a competitive cost.”
Embedded with Laird Technologies’ server-client protocol, the LT2510 permits each module to communicate with any other in-range module for true peer-to-peer operation. “Out of range” modules can be reached via a meshing topology. The configuration and test software enables OEMs to structure and optimize networks to suit their application.
Enhanced API commands provide packet routing control and network intelligence. With its field-proven FHSS air interface protocol, the LT2510 rejects RF noise, excels against multipath scenarios, allows for co-located systems, and provides an extremely reliable communication link.
With over 150 Kb/s throughput in half-duplex mode, the LT2510 delivers speedy data rates. In addition, variable output power options (up to one watt) enable communication over distances that are not achievable with competing technologies. A range of ultra-low power modes, plus low TX/RX power consumption, make the LT2510 ideal for power-restrictive or battery-operated applications. The SMT package is well-suited for space-constrained designs and is available in pick-and-place packaging for volume manufacturing.
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