- Buyers Guide
Rogers to Feature Advanced Circuit Material and Thermal Solutions
Rogers will be showcasing new advanced packaging material and thermal management solutions at the upcoming IMAPS show (November 4-6, Providence, RI).
Rogers' Advanced Circuit Materials Division (ACMD) will feature its new RO2808 high frequency circuit material. With a dielectric constant of 7.6, the ceramic-filled PTFE material offers the stability and high frequency performance of LTCC. It boasts low loss tangent of 0.002 or less and can be supplied as 1-mil thick boards to support low profile designs. RO2808 laminate features high moisture resistance, high reliability and excellent high frequency performance.
Rogers ACMD will also be highlighting its other chip packaging materials, including RO4000 laminates and prepregs, ULTRALAM 3000 laminates and bondply and R/flex 1500 adhesive film.
Rogers' Thermal Management Solutions Division will offer its HEATWAVE metal matrix composite (MMC) material for overcoming difficult thermal management challenges through effective and efficient dissipation of excess heat. Also on display will be the COOLSPAN thermal interface materials (TIM) and electrically and thermally conductive adhesives (ETCA).
HEATWAVE MMC is an aluminum silicon carbide (AISiC) composite material that is ideal for thermal base plates and heat spreaders. Available in a wide range of thermal conductivities, it features excellent specific stiffness, tightly controlled coefficient of thermal expansion (CTE), and has considerably lower density than other thermal management materials.
COOLSPAN TIMs are non-silicone thermal conductive greases that help dissipate excess circuit and component heat efficiently. These greases feature excellent thermal stability, reliable high temperature performance, high thermal conductivity and superior demateability properties to silicone products. They can be used in both TIM-1 and TIM-2 applications, and multiple dispensing options are available.
COOLSPAN ETCA is a thermally and electrically conductive unsupported silver-filled B-staged epoxy adhesive film. This material is targeted at microwave circuit and heatsink applications where an electrical ground path is desired. Other applications include die attach, printed circuit board fabrication and advanced material composites.