- Buyers Guide
TEXAS INSTRUMENTS TO ACQUIRE CHIPCON
Texas Instruments Inc. (TI) has announced that it will acquire Chipcon, a leading company in the design of short-range, low power wireless transceiver devices. The transaction for approximately $200 M is expected to be completed this month (January 2006). Under the agreement Chipcon, which employs about 120 people, will become a wholly owned subsidiary of TI and will continue to operate from its Oslo, Norway headquarters. Its other facilities include a software design center in San Diego, CA, and sales offices in New Hampshire, Germany, Hong Kong and Tokyo.
It is envisaged that combining Chipcon’s design experience in RF transceiver and System-on-Chip devices with TI's advanced analog silicon technologies and broad systems expertise will enhance TI’s ability to offer customers complete short-range wireless solutions for consumer, home and building automation applications. The acquisition also broadens the company’s offering of RF solutions and strengthens its position in ZigBee, a global standard for wireless monitoring and control applications. "As our customers incorporate more short-range wireless technology into their designs, it is increasingly important for TI to offer a robust range of RF transceiver options," said Gregg Lowe, senior vice president for TI's High Performance Analog division commented. "The addition of Chipcon’s technical capabilities and leading RF integrated circuits will complement TI’s existing low power wireless product line and strengthen our high performance analog portfolio."
Chipcon’s president and CEO, Geir Forre, who will lead TI’s group integrating short-range wireless personnel and products from both Chipcon and TI, said, "I am very excited about the synergies of the two companies. TI's leadership as a supplier of high performance analog and ultra-low power microcontrollers opens new opportunities for Chipcon’s low power wireless product portfolio. In addition, Chipcon will benefit from TI's leading-edge manufacturing, process and packaging technology."