Fotofab, a supplier of precision thin-metal parts, offers RF and board level engineers the design flexibility and cost efficiency they need to solve tough real estate issues on congested circuit boards with their custom “dimple” shields. The dimpled, snap-fit lid permits component access for testing and other procedures while eliminating the need for space-robbing lid-fixing hardware. Fotofab's production process allows the latitude to create shielding solutions without dimensional constraints, even in complex shapes.
This allows engineers to accommodate multiple components within complex circuit board layouts, all while realizing the cost savings and fast lead times of Fotofab’s photochemical machining process. For more information, visit Booth 734.