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STMicroelectronics and Automotive Communications Systems (ACS) are to jointly develop communications integrated circuits for Vehicle and Infrastructure Integration (VII). The VII initiative is investigating the potential safety benefits of car-to-car and car-to-roadside high-speed communications.
Contributors include the US Federal Government, state governments, the world’s leading car companies, suppliers, consultants and others. This programme is part of a plan to significantly improve roadway safety and utilization, lower travel times and provide unprecedented access to information for the driving public.
As a long time leader in automotive electronics and semiconductor manufacturing, STMicroelectronics brings to the relationship significant technology and product expertise in the automotive semiconductor arena as well as communications and location expertise. ACS brings a patent pending architecture for resolving some of the major challenges facing the VII initiative such as channel access, reliability of communications, and precision vehicle location at a much lower cost than current solutions.
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