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Industry News

Pad Geometry Scaling and Removal in Advanced Capacitor Models

November 12, 2007
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Pad scalability corresponds to the ability to change the dimensions of the bonding or solder pad used for attachment of a surface mount component. In this paper, a new pad scalability feature added to selected Global Models contained in Modelithics CLR Library[1,2] is discussed.

We demonstrate the excellent correlation between high frequency measured data and simulated performance by using ATC capacitors and corresponding models. Some interesting features such as arbitrary pad shape simulation and new statistical analysis are also explored.

The pad scalability feature will become available in an increasing number of Modelithics models in future releases of the library.

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