Delivering superior RF performance in high frequency wireless systems, the DB0603N 3 dB 90-degree coupler from AVX Corp. features a miniature 0603 package size and low insertion loss of typically 0.2 dB.
The couplers suit applications in balanced amplifiers and signal distribution in wireless communications for frequency bands at 3.5, 3.0, 2.4 and 2.14 GHz.
Based on AVX Proprietary RFAP thin-film technology, the couplers deliver low parasitics, leading high-frequency performance, rugged construction for automatic assembly and high power handling of 3 W. RoHS compliant, these miniature devices provide high isolation, amplitude balance of 0.3 dB typical and phase balance of 2 degrees typical.
Land Grid Array (LGA) terminations minimize parasitic inductance, while providing further benefits such as inherent low profile, self-alignment during reflow soldering, excellent solderability and better heat dissipation. Terminations are Nickel with a lead-free solder coating compatible with automatic soldering technologies.
The thin-film silicon dioxide dielectric is much thinner, around 1 μm compared to Low Temperature Co-fired Ceramic (LTCC) of 50 to 250 μm, which enables much higher capacitance density. This by far outweighs the low dielectric constant of thin-film. In addition, the conductors used for the electrodes have lower resistivity (of the order of 1 milliohm per mm square) than LTCC counterparts (10 to 20 milliohms per mm square). This allows for higher RF-power handling.
>RFAP leads to smaller, more precise devices with better RF performance, superior temperature stability, high levels of repeatability, better termination compatibility with SMD processes and flexibility for design engineers.