Rogers Corp. will showcase several advanced circuit materials this week at EuMW in Booth #A 510-512. These products are used in a wide range of high frequency applications, including the advanced packaging, antenna and power amplifier markets.

Products that Rogers Corp. will display at EuMW include:

New Enhanced Copper Bond Technology

• This low profile copper technology provides tighter trace width tolerances, lower insertion loss and improved passive intermodulation at high operating frequencies.

Advanced Packaging Materials

• Thermoset Materials: Products such as RO4350B™, RO4450B™, RO4450D™ laminates offer low moisture absorption and low loss, as well as FR4 and lead-free multi-layer processing capabilities. They are also available in 0.004" to 0.060" thicknesses.

• Thermoplastic Materials: The RO2800® and ULTRALAM® 3000 materials are available in thin dielectric layers (0.001" to 0.004") and exhibit low loss and low moisture absorption. They also are lead-free, making them environmentally friendly.

Antenna Grade Materials

• This wide range of antenna grade materials exhibit losses as low as 0.0013 and reduced PIM. A variety of options including thick dielectric grades and high Dk are also available.

As a pioneer in the advanced circuit materials field, Rogers Corp. has helped shape the high frequency marketplace by developing innovative products such as the RT/duroid® 5000 series, RT/duroid® 6002, RO3000®, RO4000® and TMM® laminates. Its products are integrated into a variety of applications in the automotive, antenna, high-speed digital, military, wireless communications, advanced packaging and consumer electronic markets.