advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
Industry News

Smart Design Practices Address EMI/EMC Challenges

June 14, 2007
/ Print / Reprints /
| Share More
/ Text Size+
To produce more circuit functionality, leading-edge designs rely on high-speed devices, using the latest IC process nodes and advanced package technologies. As the complexity of these electronic products intensifies, constraining EM emissions within dense printed circuit boards (PCB), IC packages and even the IC itself requires careful engineering. With...
To view the full article, please register or login.

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement