Hesse & Knipps GmbH Semiconductor Equipment, a manufacturer of high speed fine pitch wedge bonders for the backend semiconductor industry, announced that it will be demonstrating its BONDJET BJ820 fully automatic thin wire bonder at the 2007 International Microwave Symposium (IMS).
The demonstration will take place in booth #1701.
The BONDJET BJ820 handles all wire bonding applications in a single platform – RF and microwave devices, COB, MCM and hybrids, fiberoptics and automotive using aluminum or gold wire or ribbon.
The BJ820 is ideally suited for microwave applications due to these advanced features:
• Constant loop height and wire length
• 10 μm or better loop repeatability
• Capability to maintain parallel loops within mixed reference system
• Ribbon bonding from 6 μm x 35 μm to 25 μm x 250 μm
• 12.5 μm to 85 μm diameter wire bonding
• Auto teach for linear applications, reducing programming time
“This machine performs well across the board for challenging wire bonding applications,” said Joe Bubel, president of Hesse & Knipps Inc. “We look forward to presenting the BJ 820’s RF and microwave capabilities first-hand to the attendees of the IMS show.”