As part of an on-going commitment to continuous improvement, United Monolithic Semiconductors (UMS) has announced that it is relocating its wafer back-side activity from its facility in Orsay, France, to that in Ulm, Germany.
This strategic move concentrates the company’s wafer fabrication in Ulm, thus providing manufacturing synergies and cycle time advantages. The qualification work associated with this move will be completed by the end of June 2007, with the manufacturing ramp up phase having already started in Ulm.