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Industry News

NXP and TSMC Strengthen R&D Cooperation

February 13, 2007
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NXP Semiconductors and TSMC will strengthen their cooperation to include advanced R&D in CMOS process technologies as well as having a manufacturing partnership. The strengthened global R&D cooperation will be built upon the existing NXP research organization at the IMEC facilities in Leuven, Belgium, and TSMC corporate R&D in Hsinchu, Taiwan. It leverages the R&D talent and infrastructures of both companies in the area of IP, design, modeling, materials and process technologies.


NXP has a fruitful cooperation with IMEC, Europe's leading independent research center in the field of microelectronics, nanoelectronics and nanotechnology. TSMC is also a core member of IMEC. The joint research effort will enable NXP to do proprietary development based on TSMC platform technology and will also enable TSMC to further expand its research activities in Europe.

"We’ve chosen to strengthen our cooperation with TSMC, in the area of advanced CMOS development," said Frans van Houten, NXP president and CEO. "This move will enable NXP to concentrate more on creating innovative, differentiating process options, such as embedded non-volatile technology in 45 nm for its state-of-the-art system-on-chip products, while building on the process platform from TSMC. It underlines our commitment to be a leader in advanced CMOS system chips.’’

On behalf of TSMC, the company’s president and CEO, Rick Tsai, replied, "With our strengths of technology leadership, manufacturing excellence and customer partnership, TSMC has become a strategic partner for many global customers with whom we have forged a powerful competitive force in the semiconductor industry. This agreement with NXP Semiconductors represents an extension of the long-term strategic and fruitful alliance between the two companies. The synergy between these two global technology leaders will achieve new milestones in the foreseeable future."

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