- Buyers Guide
5G and IoT Supplement
* Electromagnetic Simulation Using the FDTD Method
Dennis M. Sullivan
165 pages; $89.95
This book is not a theoretical explanation of finite-difference-time-domain (FDTD) simulation. Instead its main purpose is to enable the reader to learn how to do three-dimensional electromagnetic simulation using the FDTD method. It is aimed at those engineers and students that would like to learn to do FDTF simulation in a reasonable amount of time.
The book is structured as a tutorial where every chapter addresses an additional level of complexity. That is, the text starts with one-dimensional simulation and progresses to two- and three-dimensional examples. Also, the analysis starts with free space, then progresses to dielectric material, lossy dielectric material and, finally, frequency-dependent material.
The first chapter covers one-dimensional simulation in free-space. A step-by-step introduction to the FDTD method is provided with appropriate example problems to be solved. Chapter 2 presents some advanced concepts within the one-dimensional simulation framework. The use of flux density in the simulation is described, providing advantages for later simulations involving frequency-dependent materials. Chapter 3 introduces two-dimensional simulation, beginning with a simple point source for an example. Then absorbing boundaries are described, along with their implementation into the FDTD program.
Chapter 4 covers three-dimensional simulation. Here, the simulation becomes considerably more difficult. Chapter 5 provides two examples to illustrate the use of FDTD, the characterization of a stripline antenna and the calculation of the far field of an aperture antenna using a time domain transformation. The final chapter describes using FDTD for other types of simulation (other than electromagnetics). Examples are provided for acoustic simulation, and simulation of the Schroedinger equation, the heart of quantum mechanics. Appendix A describes the use of the Z transform when dealing with digital signals.
The book is written as a tutorial for either course work or self study. Each chapter contains a concise explanation of an essential concept and instruction on its implementation into computer code.
To order this book, contact: (The Institute of Electrical Engineers) Inspec Dept., IEEE Operation Center, P.O. Box 1331, Piscataway, NJ 08855-1331 (908) 562-5553.
* Microwave Materials and Fabrication Techniques
Thomas S. Laverghetta
Artech House Inc.
287 pages; $83, £57
This third edition of the book provides much needed updates with regard to microwave materials, computer-aided fabrication tools, plating processes and other areas driven by the recent boom in commercial wireless microwave applications and the advances in materials and processes resulting from that effort. The intention remains the same: to educate the microwave circuit designer in material and fabrication techniques, so as to avoid problems in converting theoretical designs to practical hardware.
Following a brief introductory chapter, Chapter 2 describes the latest laminate and substrate materials and their properties. This area has seen some of the most dramatic changes with the development of new materials to meet the commercial demands of the wireless market. Chapter 3 discusses metals used in fabrication and remains largely as before.
Significant changes have been made to update the chapter on microwave artwork. Here the methods used to generate the artwork have improved significantly and Chapter 4 describes the latest computer-aided methods to go from circuit design to board fabrication automatically. Chapter 5 covers etching and plating, and contains new material on plated-through-hole fabrication techniques with regard to the newer materials. Chapter 6 on bonding techniques has remained largely unchanged except for the addition of some newer solders and epoxies in use today. The final chapter on microwave packaging primarily deals with stripline, microstrip and suspended substrate circuit configurations, and describes the techniques used to implement effective external packaging of those circuits.
The many appendices have also been updated where appropriate, and provide useful reference data for designers including selected data sheets for some of the circuit material referred to in the text. In general, the book is a good reference text for designers involved in the development of practical microwave circuit products.
To order this book, contact: Artech House Inc., 685 Canton St., Norwood, MA 02062 (781) 769-9750, ext. 4002; or 46 Gillingham St., London SW1V 1HH, UK +44 (0)20 7596-8750.
"...how to do three-dimensional electromagnetic simulation using the FDTD method."
"...a good reference text for designers involved in the development of practical microwave circuit products."
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