Orange County startup Integra Devices introduces an innovative manufacturing paradigm (AMALGA™) that enables the ability to fabricate hollow, metal waveguide and coaxial structures inside and on top of electronic substrates. In addition, filters, diplexers, switches, attenuators and other components can be integrated within these structures.
Now, mmWave modules and assemblies can be miniaturized through the use of these low loss, high density interconnects and components; leading to high packaging density, excellent isolation and low weight solutions. Batch fabricated on panels, Integra's manufacturing technology allows for scalable, cost-effective production, from hundreds to millions of units. MMIC's and active components can be directly integrated since these traces lay embedded or on top of printed circuit boards.
"mmWave frequencies (28 GHz and above) are becoming increasingly popular for applications such as 5G wireless communications networks, to support moving massive amounts of data quickly. Unfortunately, current transmission line technologies provide challenges for mmWave engineers looking to design practical systems," states Sourabh Dhillon, director of business development at Integra. "Microstrip and co-planar waveguide circuits can be troublesome and require careful design since such circuits behave like antennas at high frequencies, radiating signal from the desired path and resulting in cross-talk and losses. Waveguide routing, although optimally contain mmWave signal, unfortunately leads to 'the plumber's nightmare'...large, bulky systems. We're thrilled to offer the microwave/mmWave world with a new solution to alleviate this dilemma."
Beamforming networks, directional antennas, nxm switching matrices and many more micro-assemblies can now be realized to push forth innovation for the communications, mil-aero and test & measurement industries.