The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the industry event that brings together RF/microwave and high-speed digital design engineers and system integrators, has opened the Call for Abstracts for EDI CON USA 2018. Selected papers will be presented at EDI CON USA 2018, held October 17-19, 2018 at the Santa Clara Convention Center, Santa Clara, Calif.

Track selections include RF & Microwave Design, Mobile Front End Design, Low Power RF & IoT, 5G Advanced Communications, Broadband Networks, Radar & Defense, Amplifier Design, Signal Integrity, Power Integrity, EMC/EMI, Simulation & Modeling and Test & Measurement.

This year’s Technical Advisory Committee (TAC) is led by co-chairs Jin Bains, head of connectivity, SCL, at Facebook, and Ransom Stephens, Ph.D., author, technologist and physicist. The EDI CON USA 2018 TAC will evaluate submitted abstracts based on quality, relevance, impact and originality. To be accepted, submissions must be high quality and comprehensive, aimed at advancing the knowledge of attendees.

“EDI CON technical sessions are educational, providing practical information on how to address today’s design challenges using available materials, tools, products, and techniques,” said Janine Love, event director. “We are looking forward to putting on another engaging and constructive conference and exhibition for engineers working on the latest RF, microwave and digital designs.”

The Call for Abstracts closes May 3, 2018. More information and the submission portal is available online.

EDI CON USA 2018 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. More information, including how to exhibit at EDI CON USA 2018, is available at EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, Calif.) on October 17-19, 2018.